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Antenna-on-package integrated circuit device

A technology of integrated circuits and packages, which is applied in the field of packaged antenna integrated circuit devices, and can solve the problems of large and powerful systems

Pending Publication Date: 2021-11-12
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such systems are usually large and powerful

Method used

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  • Antenna-on-package integrated circuit device
  • Antenna-on-package integrated circuit device
  • Antenna-on-package integrated circuit device

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0014] Specific examples will be described in detail below with reference to the accompanying drawings. These examples are not intended to be limiting, and no feature is required for any particular example unless otherwise stated. In addition, in the following description, forming a first feature on or over a second feature may include an example in which the first feature and the second feature are formed in direct contact as well as an example in which the first feature and the second feature are formed between the first feature and the second feature. An example of adding a feature so that the first feature and the second feature are not in direct contact.

[0015] Relative terms describing orientation, such as "above", "below", "above", "below", "on" etc. are provided for the sake of clarity and are not absolute relationships. For example, a first element that is "above" a second element could correctly be described as "below" the second element if the orientation of the ...

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PUM

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Abstract

In some examples, an integrated circuit package (100) is an antenna-on-package package that includes an integrated circuit die (102) and an antenna substrate (110) coupled to the integrated circuit die (102). The antenna substrate (110) includes a conductor layer (130) and a first dielectric layer (118) disposed between the conductor layer (130) and the integrated circuit die (102). The conductor layer (130) includes antennas (154) electrically coupled to the integrated circuit die (102). The integrated circuit package (100) further includes an I / O substrate (112) coupled to the integrated circuit die (102) opposite the antenna substrate (110). In some such examples, the I / O substrate (112) includes interconnect connectors (152) and a second dielectric layer (126) disposed between the interconnect connectors (152) and the integrated circuit die (102). In some such examples, the integrated circuit package (100) includes interconnect connectors (150) extending between the antenna substrate (110) and the EO substrate (112).

Description

Background technique [0001] Large radar systems are used to track aircraft, forecast weather, study geological formations, observe planets, and other remote applications. Such systems are often large and powerful. At the same time, rapid advances in signal processing and semiconductor manufacturing enabled the miniaturization of radar systems. These low-power, low-cost radar systems open the door to a variety of applications including autonomous vehicles, automated material handling systems, collision avoidance, and other applications. [0002] Radar systems sense distant objects by transmitting electromagnetic waves using one or more transmitter antennas and receiving the reflections of the electromagnetic waves using one or more receiver antennas. Control of transmitted signals and processing of received signals may be performed by multiple active and passive integrated circuit devices on one or more integrated circuit dies. In turn, the dies and devices may be incorporat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/118H04B7/0413H10N97/00
CPCH01Q1/2283H01Q9/0407H01Q21/065H01Q1/38H01L28/10H01Q1/525H01Q1/3233H01L27/0203H01Q1/24H01Q23/00
Inventor M·莫阿伦
Owner TEXAS INSTR INC