Etching equipment

Abstract

The invention provides etching equipment. The etching equipment comprises an etching machine and a cooling system. The cooling system comprises an evaporator, an air exhaust mechanism, a condenser and a control unit. The evaporator is provided with an evaporation chamber, the evaporation chamber is filled with a refrigerant and is communicated with an outlet and an inlet, the etching machine is connected with a cooling pipeline, etching liquid circulates in the cooling pipeline and is adjacent to the evaporation chamber, the evaporator is used for cooling the etching liquid through heat exchange between the refrigerant and the etching liquid, and the refrigerant is evaporated from a liquid state to a gas state after absorbing heat; the air exhaust mechanism is connected to an outlet of the evaporation cavity and used for conveying the gaseous refrigerant to the condenser. The condenser is connected to the air exhaust mechanism and an inlet of the evaporation cavity and used for condensing a gaseous refrigerant into a liquid refrigerant and then conveying the liquid refrigerant to the evaporation cavity for circulation. The control unit is connected with and controls the evaporator, the air exhaust mechanism and the condenser.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing equipment, in particular to an etching equipment. Background technique [0002] Wet etching in the semiconductor industry has higher and higher temperature requirements for SPM-APM related processes. The process will generate a large amount of high-temperature sulfuric acid that cannot be directly discharged into the factory system. The cooling device of the existing etching equipment mainly uses cooling water for heat exchange and cooling. Mainly, this puts forward higher requirements for the cooling device. It is required that the cooling device can not only meet the process requirements to reduce the temperature quickly and accurately, but also ensure the safe and reliable normal operation of the cooling device, and achieve economic and environmental protection indicators. [0003] However, the cooling device using the cooling water heat exchange cooling method usu...

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Problems solved by technology

[0003] However, the cooling device using the cooling water heat exchange cooling method usually needs to be equipped with multiple such cooling devices because the cooling effect is not obvious. As the temperature of sulfuric acid decreases, the temperature difference decreases, which will lead to poor cooling effect and poor economic efficiency. cause waste of water resources

As the temperature of the process rises, the cooling device that adopts the cooling water heat exchange cooling method will cause the host computer to fail to discharge the sulfuric acid due to the overtime temperature control or the untimely cooling of the sulfuric acid in the cooling device, resulting in interruption of the process, affecting the chip manufacturing process and increasing defects. risk

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