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A circuit board dust removal device for integrated circuit testing

A technology for dust removal equipment and integrated circuits, which is applied in the field of circuit board dust removal equipment for integrated circuit testing, can solve the problems of circuit board equipment operation failure, circuit boards easily attracting dust, and dust cannot be discharged.

Active Publication Date: 2022-07-12
孝感慧硕电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The integrated circuit board is a carrier for carrying integrated circuits. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board uses semiconductor manufacturing technology to manufacture many transistors and resistors on a small single crystal silicon chip. However, after the circuit board has been working for a long time, the surface of the circuit board is easy to absorb dust, which affects the use of the circuit board. Most of the circuit board dust removal equipment in the market uses a vacuum device. Function, the dust absorbed by the vacuum device is very easy to stick to the nozzle, so that the dust cannot be discharged, resulting in incomplete dust removal, and the ambient temperature of ordinary circuit board dust removal equipment should not exceed 40 degrees, if it works in high temperature for a long time , so that the circuit board dust removal equipment is overloaded, which will cause the circuit board equipment to fail during operation

Method used

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  • A circuit board dust removal device for integrated circuit testing
  • A circuit board dust removal device for integrated circuit testing
  • A circuit board dust removal device for integrated circuit testing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] as attached figure 1 to the attached Figure 4 shown:

[0023] The present invention is a circuit board dust removal device for integrated circuit testing. The heat dissipation window 2 is fixed on the middle surface of the left end of the processing mechanism 3. The processing mechanism 3 runs through the middle end of the bracket 4. The lower end of the processing mechanism 3 is provided with a dust exhaust port 5. The processing mechanism 3 includes a casing 31, a heat dissipation device 32, an air outlet 33, a dust removal device 34, and a dust drop groove 35. The left end of the air blowing port 33 is connected with the right end of the air pipe 1 , the lower end of the air blowing port 33 is installed with a dust removal device 34 , the upper end of the dust drop groove 35 is installed at the lower end of the dust removal device 34 , and the dust drop groove 35 is installed inside the dust discharge port 5 .

[0024] The heat dissipation device 32 includes a sh...

Embodiment 2

[0029] as attached Figure 5 to the attached Figure 7 shown:

[0030] The dust removal device 34 includes a casing 341, a dust suction port 342, a placing plate 343, a scraping device 344, and a dust removal device 345. The dust suction port 342 is installed on the upper sides of the left and right ends of the placing plate 343, The inner wall of the left and right ends of the casing 341 is provided with a pushing and scraping device 344, and the lower end of the pushing and scraping device 344 is fixedly installed with a ash removal device 345. Both ends of 343 are provided with pushing and scraping devices 344, the upper end of the dust removal device 345 is provided with a placing plate 343, and the upper end of the dust suction port 342 is provided with a dust suction fan, which facilitates the rapid entry of dust on the surface of the circuit board into the dust suction port 342.

[0031]The scraping device 344 includes a scraping brush 44a, a connecting rod 44b, a spr...

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PUM

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Abstract

The invention discloses a circuit board dust removal device for integrated circuit testing. Its structure includes an air pipe, a heat dissipation window, a processing mechanism, a bracket and a dust discharge port. On the middle surface of the left end of the mechanism, a heat sink is installed at the top of the processing mechanism, and the sliding shafts installed at the left and right ends of the temperature sensing tube rise as the temperature rises in the chute, so that the push rod slides upward, and the shutter plate follows the push rod. The opening and closing plate connected by the sliding rod and the push groove rotates upward to close, and there are dust suction ports on the upper sides of the left and right ends of the placing plate. The dust scraping brush installed on the upper end of the rod scrapes the inner wall of the casing, so that the dust is more effectively scraped onto the dust collecting plate, and the dust enters the dust collecting groove more effectively through the small holes on the dust collecting plate to prevent the dust from sticking. It cannot be discharged on the ash collecting board.

Description

technical field [0001] The invention relates to the field of integrated circuit testing, more particularly, to a circuit board dust removal device for integrated circuit testing. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board adopts a semiconductor manufacturing process, and many transistors and resistors are made on a small single crystal silicon wafer. However, after the circuit board works for a long time, the surface of the circuit board is easy to absorb dust, which affects the use of the circuit board. The circuit board dust removal equipment on the market mostly adopts a vacuum device. The dust absorbed by the vacuum cleaner is very easy to stick to the nozzle, so that the dust cannot be discharged, resulting in incomplete dust removal, and the operating environment temperature of ordinary circ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B5/04B08B17/04B08B9/087B08B15/04B08B7/02
CPCB08B5/04B08B17/04B08B9/087B08B15/04B08B7/02
Inventor 田婷婷
Owner 孝感慧硕电子科技有限公司
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