Semiconductor material deep hole machining device and using method thereof

Abstract

The invention discloses a semiconductor material deep hole machining device and a using method thereof. The semiconductor material deep hole machining device comprises a machining table which is of a box structure, the side face of the machining table is fixedly connected with a rack, a drilling device is fixedly installed on the side face of the rack, a pump body is installed on the side face of the machining table, the water inlet end of the pump body communicates with the interior of the machining table through a water pipe, a detachable collecting box is assembled on the side face of the machining table, a fixing plate is fixedly connected to the inner face of the machining table, the side face of the fixing plate is attached to the inner face of the machining table, an opening is formed in the fixing plate in a penetrating mode, and the inner surface of the opening is fixedly connected with a filter screen. When the device is used, the situation that the filter screen is blocked due to the fact that a large number of chippings are accumulated on the filter screen can be avoided, the smoothness of the filter screen is guaranteed, cooling liquid can smoothly pass through the filter screen, workers do not need to manually clean the filter screen regularly, and the machining efficiency of the device is guaranteed.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a semiconductor material deep hole processing device and a method for using the same. Background technique [0002] Semiconductor materials are a class of electronic materials that have semiconductor properties and can be used to make semiconductor devices and integrated circuits. [0003] Magnetic semiconductor materials require deep hole processing during the production process. In order to reduce the adverse effects of the high temperature generated when the drill bit rotates at high speed on the semiconductor material, the device generally sprays coolant towards the position where the drill bit contacts the semiconductor material during the drilling process. , the debris generated during the drilling process will be mixed in the coolant, and the coolant mixed with debris will enter the circulation tank for recycling and secondary use. In order to pre...

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Problems solved by technology

[0003] During the production process of magnetic semiconductor materials, deep hole processing is required. In order to reduce the adverse effects of the high temperature generated when the drill bit rotates at high speed on the semiconductor material, the device generally sprays coolant towards the position where the drill bit contacts the semiconductor material during the drilling process. , the debris generated during the drilling process will be mixed in the coolant, and the coolant mixed with debris will enter the circulation tank for recycling and secondary use. In order to prevent debris from damaging the internal rotor of the circulating pump, the device Generally, there is a filter screen for filtering debris in the coolant. With the use of the device, a certain amount of debris will be attached to the filter screen, and the debris will block the mesh of the filter screen, thereby causing the blockage of the filter screen. The coolant cannot pass through the filter screen smoothly. In this case, it is necessary for the staff to stop the machine to clean up the debris on the surface of the filter screen. Not only is the operation process very inconvenient, but it also limits the processing efficiency of the device. Therefore, it is necessary to design a semiconductor material Deep hole processing device and its use method to solve the above problems

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