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Heat dissipation module and electronic device

A technology for heat dissipation modules and electronic devices, which is applied in the directions of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., and can solve problems such as poor flow effect and limited heat dissipation effect

Pending Publication Date: 2021-11-26
ACER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the heat transfer medium only flows in the circuit by its own phase change, and its flow effect is poor, which makes its heat dissipation effect limited

Method used

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  • Heat dissipation module and electronic device
  • Heat dissipation module and electronic device
  • Heat dissipation module and electronic device

Examples

Experimental program
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Effect test

Embodiment Construction

[0033] figure 1 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. figure 2 is the hysteresis curve of magnetic particles at different temperatures. Please also refer to figure 1 and figure 2 , in this embodiment, the heat dissipation module 100 is suitable for an electronic device, and the electronic device has a heat source 11, such as a processor chip or a display chip of the electronic device, and the heat dissipation module 100 includes a pipeline 110, a magnetic generator 120, a working The fluid 140 and the plurality of magnetic particles 130 , wherein the pipeline 110 has a heating zone 112 and a cooling zone 113 , and the heat source 11 is in thermal contact with the heating zone 112 so that the heat generated by the heat source 11 is transferred to the heating zone 112 . The magnetic generator 120 , including an electromagnet, a permanent magnet or a combination thereof, is disposed outside the pipeline 110 a...

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Abstract

The invention discloses a heat dissipation module which is arranged on an electronic device. The electronic device has a heat source. The heat dissipation module comprises a pipeline, a magnetic generator, a working fluid and a plurality of magnetic particles. The pipeline has a heating area and a cooling area. The heat source thermally contacts the heating area to transfer heat to the heating area. The magnetic generator is arranged outside the pipeline and corresponds to the heating area. The working fluid fills the pipeline. The magnetic particles are movably disposed in the working fluid. When the heating area is located above the cooling area in the gravity direction, the magnetic particles passing through the heating area are subjected to magnetic loss due to heat absorption and temperature rise and move to the cooling area by means of gravity. The magnetic particles in the cooling area are magnetically recovered due to heat dissipation and temperature reduction, and are magnetically absorbed back to the heating area by the magnetic generator. The travel of the magnetic particles in the pipeline forms a cycle.

Description

technical field [0001] The invention relates to a cooling module and an electronic device. Background technique [0002] In recent years, with the increasing development of the technology industry, electronic devices such as notebook computers, personal digital assistants and smart phones have frequently appeared in daily life. Some of the electronic components installed in these electronic devices usually generate heat energy during operation. If the accumulated heat energy cannot be discharged smoothly, the operation performance of the electronic device will be affected. Therefore, a heat dissipation module or a heat dissipation element, such as a heat dissipation fan, a heat dissipation sticker, or a heat dissipation pipe, is usually arranged inside the electronic device to assist in dissipating the heat energy generated by the electronic element to the outside of the electronic device. [0003] In the above heat dissipation module, the heat dissipation fan can effective...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/2029H05K7/20327
Inventor 黄瀚梁廖文能谢铮玟陈宗廷陈伟今
Owner ACER INC
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