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Infrared detector pixel and infrared detector based on CMOS process

An infrared detector and process technology, applied in the field of infrared detection, can solve the problems of reducing the difficulty of releasing the sacrificial layer, low infrared detector performance, low pixel scale, etc., and achieve the realization of chip miniaturization, reduction of process difficulty, and small chip area Effect

Active Publication Date: 2021-11-30
BEIJING NORTH GAOYE TECH CO LTD
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Problems solved by technology

[0011] In order to solve the above-mentioned technical problems or at least partly solve the above-mentioned technical problems, the present disclosure provides an infrared detector pixel and an infrared detector based on a CMOS process to solve The problems of low performance, low pixel scale and low yield rate of traditional MEMS process infrared detectors are solved. The airtight release isolation layer located in the CMOS infrared sensing structure reduces the difficulty of releasing the sacrificial layer.

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  • Infrared detector pixel and infrared detector based on CMOS process
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  • Infrared detector pixel and infrared detector based on CMOS process

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Embodiment Construction

[0048] In order to more clearly understand the above objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, in the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other.

[0049] In the following description, many specific details are set forth in order to fully understand the present disclosure, but the present disclosure can also be implemented in other ways than described here; obviously, the embodiments in the description are only some of the embodiments of the present disclosure, and Not all examples.

[0050] figure 1 It is a schematic diagram of a three-dimensional structure of an infrared detector pixel provided by an embodiment of the present invention, figure 2 yes figure 1 The schematic diagram of the top view structure of the infrared detector pixel provided, image 3 yes figure 1 T...

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Abstract

The invention relates to an infrared detector pixel and an infrared detector based on a CMOS process, the infrared detector pixel comprises a CMOS measurement circuit system and a CMOS infrared sensing structure located on the CMOS measurement circuit system, at least one closed release isolation layer is arranged on the CMOS measurement circuit system, and the at least one closed release isolation layer is located in the CMOS infrared sensing structure; the infrared conversion structure comprises an absorption plate and a plurality of beam structures, in at least part of the orthographic projection area of the absorption plate, the closed release isolation layer located in the CMOS infrared sensor structure is etched, at least one closed release isolation layer is located on the interface between the CMOS measurement circuit system and the CMOS infrared sensor structure, and the problems that a traditional MEMS process infrared detector is low in performance, low in pixel scale, low in yield and the like are solved, and the release difficulty of the sacrificial layer is reduced by the closed release isolation layer in the CMOS infrared sensing structure.

Description

technical field [0001] The present disclosure relates to the technical field of infrared detection, and in particular to an infrared detector pixel and an infrared detector based on a CMOS process. Background technique [0002] Surveillance market, automotive auxiliary market, home furnishing market, intelligent manufacturing market, and mobile phone applications all have strong demand for uncooled high-performance chips, and have certain requirements for chip performance, performance consistency, and product prices. It is estimated that there is a potential demand of more than 100 million chips every year, but the current process scheme and architecture cannot meet the market demand. [0003] At present, the infrared detector adopts the method of combining the measurement circuit and the infrared sensing structure. The measurement circuit is prepared by CMOS (Complementary Metal-Oxide-Semiconductor, Complementary Metal Oxide Semiconductor) technology, and the infrared sensi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/20G01J5/02
CPCG01J5/20G01J5/0205
Inventor 翟光杰武佩潘辉翟光强
Owner BEIJING NORTH GAOYE TECH CO LTD
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