A lead frame feeding and conveying device

Abstract

The present application provides a lead frame feeding and conveying device, including: a material storage mechanism, a turning suction cup, and a conveying mechanism. The stocking mechanism is provided with a lifting plate that moves vertically and is used for storing the lead frame. The flip suction cup is rotated and set; the front part of the flip suction cup is a pair of parallel and spaced suction plates, and there are multiple ventilation holes on one side of the suction plate. The conveying mechanism includes a pair of rails arranged at intervals, and the rails are in an L-shaped structure; the middle position of the rails is moved along the length direction and a push plate is provided, and the top surface of the push plate is provided with multiple paddles at intervals along the length direction, and the size of the interval is larger than that of the lead frame. Length; the paddle can be protruded or hidden in the push plate; there is a gap between the push plate and the rails on both sides. When the suction cup is turned over and turned to the conveying mechanism, the two suction plates are respectively located in the gap between the push plate and the rails on both sides. It has high adsorption firmness, which can prevent the lead frame from falling during the feeding process; at the same time, it can transport the lead frame more stably and accurately.

Description

technical field [0001] The invention belongs to the technical field of semiconductor device packaging, in particular to a lead frame feeding and conveying device. Background technique [0002] For semiconductor devices, chips are usually solidified on the leads of the lead frame, and then individual devices are formed through processes such as packaging and rib cutting. The leads of the lead frame usually have a bent structure, so that a part of the lead protrudes from the entire plane of the lead frame. In the production process, multiple processes require fast feeder delivery of the lead frame. When feeding, most of the existing equipment adopts a plurality of straws to absorb the lead frame through negative pressure; and usually when feeding the machine, the protruding side of the pin is set on the top to facilitate sticking the core; however In this case, there are relatively few positions on the lead frame for suction of the straw, and the overall area will not be too...

AI Technical Summary

Problems solved by technology

Because the lead frame will slip due to the way of friction, it is impossible to ensure that the lead frame moves to the next position accurately, so it is necessary to add a position detection sensor to ensure that the lead frame is in place

However, the structure of this kind of device is relatively complicated, and there are many electrical control links, which is not only inconvenient for installation and debugging of the device, but also has a relatively high failure rate in later use.

Moreover, the transportation method using friction will lead to poor stability and accuracy of lead frame transportation.

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