Method for preparing large-size single crystal two-dimensional material based on chemical vapor deposition
A chemical vapor deposition and two-dimensional material technology, which is applied in the field of preparing large-size single-crystal two-dimensional materials based on chemical vapor deposition, can solve the problems of difficulty in forming a single-crystal structure, low quality of large-size single-crystal two-dimensional materials, etc. The effect of preparation cost, simplification of material types, and easy promotion and application
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[0073] The Si / SiO 2 The preparation method of the substrate is as follows: the commercial Si sheet is vapor-deposited with SiO 2 layer, and the evaporated SiO 2 One side of the layer is polished to serve as the substrate.
[0074] Further, SiO 2 The thickness of the layer is 200-300nm;
[0075] Further, the distance between the different temperature zones is 15-20cm;
[0076] (2) Use inert gas to vacuum flush the furnace cavity;
[0077] Further, the furnace cavity is evacuated, and an inert gas is introduced until the pressure of the furnace cavity is 0.5-1 atm, and then the furnace cavity is evacuated, and the operation is repeated, and the furnace cavity is vacuumed;
[0078] Further, during the vacuum flushing process of the furnace cavity, the number of repetitions is 3 to 5 times to fully ensure that there is no gas irrelevant to the reaction such as oxygen and water vapor in the furnace cavity.
[0079] (3) Raise the temperature in different temperature zones resp...
Embodiment 1
[0089] A method for preparing a large-scale single-crystal two-dimensional graphene material, comprising steps as follows:
[0090] (1) Select metallic copper Cu as the substrate, and perform pretreatments such as cleaning, electrochemical polishing, and oxidation;
[0091] (2) Place the pretreated Cu substrate in the reaction furnace chamber, and then vacuumize the furnace chamber to 5×10 -5 Pa; turn off the vacuum pump unit, feed inert gas Ar, until the furnace chamber pressure is 1atm, then turn on the vacuum pump unit, pump and charge the furnace chamber, repeat 3 times, and carry out vacuum treatment to the furnace chamber;
[0092](3) Raise the temperature of the equipment to 1050°C, compare H 2 Added changes to the temperature field. Into the furnace cavity and Ar 2 (500sccm) and H 2 (10 sccm) mixed gas is used as the carrier gas, the furnace chamber is adjusted to a target pressure of 0.75 atm, and the substrate is pre-annealed for 60 min. Under this condition, th...
Embodiment 2
[0104] A preparation of large-size single-crystal two-dimensional MoSe 2 The material method comprises the following steps:
[0105] (1) Evaporate 300nm thick SiO on a commercial Si wafer 2 layer, and is evaporated with SiO 2 One side of the layer is polished as a substrate;
[0106] (2) Treated Si / SiO 2 The substrate is placed in the furnace chamber, and the polishing surface is aligned with MoO 3 Precursor; the Se powder precursor is placed in front of the substrate with a distance of 20cm;
[0107] (3) Then the furnace chamber is evacuated, and the vacuum degree is not higher than 5×10 -5 Pa; turn off the vacuum pump unit, feed inert background gas until the furnace cavity pressure is 1 atm, then turn on the vacuum pump unit, pump and charge the furnace cavity, repeat 3 times, and carry out vacuum treatment to the furnace cavity;
[0108] (4) Set the program heating respectively, the temperature of the Se area is raised to 250°C, and the heating rate is 10°C / min; Si / S...
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