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Production process of basic copper chloride

A production process, copper chloride technology, applied in the direction of copper chloride, copper halide, etc., can solve the problems of surface roughness, reduce the quality of basic copper chloride, etc., and achieve the effect of improving quality

Pending Publication Date: 2021-12-07
ZHONGSHAN DONGYUN PLATEMAKING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, basic copper chloride is often produced by an electroplating process, but the existing electroplating production process easily causes the surface of basic copper chloride to be rough, reducing the quality of basic copper chloride.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] This embodiment provides a technical solution: a basic copper chloride production process, the area of ​​the anode is larger than the area of ​​the cathode, when the area of ​​the anode is twice that of the anode, there will be some nodules on the surface of the coating, and as the electroplating time increases, the nodules will Gradually increasing, causing the layout surface is not smooth, there are burrs.

[0021] Solution: While reducing the area of ​​the anode, electrolyze the plating solution for one hour with a small current, and clean the anode at the same time to ensure that there is no copper powder in the upper tank.

Embodiment 2

[0023] This embodiment provides a technical solution: a basic copper chloride production process. The anode copper plate is made of rolled red copper plate. If an electrolytic copper plate is used, the dissolution rate of the anode will be accelerated, resulting in more copper powder and rough coating.

Embodiment 3

[0025] This embodiment provides a technical solution: a production process of basic copper chloride, which removes the small powder produced in the electroplating process in time.

[0026] In the normal electroplating process, some very fine powders will be produced. If these powders are not removed in time, they will be adsorbed on the surface of the cathode with the current, causing burrs to appear on the coating.

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PUM

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Abstract

The invention discloses a production process of basic copper chloride, and relates to the field of copper chloride hydroxide production. The process comprises the following steps: reducing the area of an anode, electrolyzing a plating solution for one hour with small current, and cleaning the anode to ensure that copper powder is not attached to an upper tank. The method solves the problem that: the surface is not smooth in the production process of the basic copper chloride, and improves the production quality of the basic copper chloride.

Description

technical field [0001] The invention relates to the technical field, in particular to a production process of basic copper chloride. Background technique [0002] Basic copper chloride is green crystal or dark green crystalline powder, insoluble in water, soluble in dilute acid and ammonia water. It reacts with alkali to form blue flocculent precipitate, which is copper hydroxide, and decomposes in boiling water to form black copper oxide. [0003] In the prior art, basic copper chloride is often produced by an electroplating process, but the existing electroplating production process easily causes the surface of basic copper chloride to be rough, reducing the quality of basic copper chloride. For this reason, we propose a kind of production process of basic copper chloride. Contents of the invention [0004] The object of the present invention is to provide a kind of basic copper chloride production technique, to solve the problem that proposes in the above-mentioned ba...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01G3/05
CPCC01G3/05
Inventor 师伟平
Owner ZHONGSHAN DONGYUN PLATEMAKING