Full-automatic cover film laminating device for flexible circuit board and application of full-automatic cover film laminating equipment

Abstract

The invention discloses a full-automatic cover film laminating device for a flexible circuit board, which comprises a workbench, a cabinet and an outer cover. The workbench is provided with a cover film rolling-out and rolling-up mechanism, a film stripping mechanism, a cover film transferring mechanism, a film laminating mechanism, a copper substrate feeding mechanism, a product transferring mechanism, a product discharging mechanism and a visual positioning assembly, the covering film rolling-out and rolling-up mechanism is used for guiding a covering film onto the film stripping mechanism and rolling and collecting stripped release paper, the film stripping mechanism is used for separating the covering film from the release paper below the covering film, and the covering film transferring mechanism is used for sucking, rotating and transferring the covering film and attaching the covering film to a copper substrate. The product transferring mechanism is used for transferring the copper substrate to the pasting table and transferring the pasted product to the product discharging mechanism. The visual positioning assemblies comprise the first visual positioning assembly and the second visual positioning assembly. The device has the advantages that the working efficiency can be improved, the equipment failure rate can be reduced, centralized operation can be achieved, operation is easy, and the service life is long.

Description

Technical field [0001] The present invention relates to a flexible circuit board automatic cover film bonding apparatus and its application, the flexible circuit board belonging to the technical field foil. Background technique [0002] A flexible circuit board (Flexible Printed Circuit Board) referred to as "FPC", the industry commonly known as an FPC, a flexible insulating base material (mainly polyimide or polyester film) made of a printed circuit board having many solid printed circuit board does not have an advantage. For example, it can be freely bent, wound, folded. Using a FPC can greatly reduce the volume of electronic products, electronic products, the need to adapt to the development of high-density, small size, high reliability direction. Therefore, FPC has been in the aerospace, military, mobile communications, portable computers, computer peripheral equipment, PDA, digital and other fields with equipment or products have been widely used on. [0003] The outer prote...

AI Technical Summary

Problems solved by technology

The existing automatic cover film bonding equipment for flexible circuit boards has the following defects: cover film absorption and transfer and peeling and pulling are performed step by step, which is time-consuming; the first camera used to detect the cover film and the first camera used to detect the copper substrate When the second camera scans, it interferes with each other, which also takes time to a certain extent; the mechanism and action of the whole device are cumbersome, with high failure rate and short service life

[0004] The publication number is 113068319A, and the title is: Chinese invention patent of film sticking mechanism and automatic cover film laminating equipment discloses a fully automatic cover film laminating equipment, which solves the problem of existing automatic cover film laminating equipment to a certain extent. However, there are still the following defects: the complex structure of the film stripping mechanism, large footprint, cumbersome mechanism and action of the entire equipment, and high failure rate; Loading and peeling materials are carried out step by step, which takes a long time and low work efficiency

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