SiC Schottky power diode and preparation method thereof
A power diode and Schottky contact technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the performance and yield degradation of 4H-SiC Schottky power diodes, high-voltage power Schottky power diodes Inconvenient productization and other issues can be achieved to improve the forward conduction capability, alleviate the phenomenon of electric field concentration, and increase the effect of current conduction area
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[0044] The present invention will be described in further detail below in conjunction with specific examples, but the embodiments of the present invention are not limited thereto.
[0045] In order to improve the performance and yield of a 4H-SiC Schottky power diode under high operating voltage, an embodiment of the present invention provides a SiC Schottky power diode. see figure 1 As shown, the SiC Schottky power diode includes: N-type 4H-SiC substrate 1, P-type 4H-SiC isolation layer 2, N-type 4H-SiC epitaxial layer 3, cathode ohmic contact metal layer 9, first passivation layer 7 , second passivation layer 8 , third passivation layer 11 and anode Schottky contact metal layer 10 . in,
[0046] The P-type 4H-SiC isolation layer 2 is stacked on the N-type 4H-SiC substrate 1; the N-type 4H-SiC epitaxial layer 3 is stacked on the P-type 4H-SiC isolation layer 2, and the N-type 4H-SiC epitaxial layer 3 The thickness is 4 μm to 6 μm.
[0047]The middle part of the N-type 4H-...
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