SiC Schottky power diode and production method thereof
A power diode and Schottky contact technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of limiting 4H-SiC Schottky power diodes and not enough to support the productization of devices, and reduce the Effect of surface leakage current, reduction of electric field concentration phenomenon, and shortening of current path
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[0042] The present invention will be described in further detail below in conjunction with specific examples, but the embodiments of the present invention are not limited thereto.
[0043] In order to realize the commercialization of a high-voltage 4H-SiC Schottky power diode above 3000V, an embodiment of the present invention provides a SiC Schottky power diode. see figure 1 As shown, the SiC Schottky power diode includes: N-type 4H-SiC substrate, P-type 4H-SiC isolation layer, N-type 4H-SiC epitaxial layer, two cathode ohmic contact metals, inverted trapezoidal anode groove, blunt layer as well as the anode Schottky contact metal.
[0044] Wherein, the P-type 4H-SiC isolation layer is stacked on the N-type 4H-SiC substrate.
[0045] The N-type 4H-SiC epitaxial layer is stacked on the top of the P-type 4H-SiC isolation layer; the thickness of the N-type 4H-SiC epitaxial layer is less than 6 μm.
[0046] Two cathode ohmic contact metals are respectively located on both side...
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