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Circuit board and preparation method thereof

A technology of circuit boards and conductive circuits, which is applied in the direction of printed circuit manufacturing, printed circuits, circuit heating devices, etc., can solve the problems of unfavorable circuit board miniaturization, affecting circuit board surface wiring, and increasing the area of ​​circuit boards, so as to achieve enhanced integration The effect of power, good heat dissipation performance, and large wiring area

Pending Publication Date: 2021-12-21
珠海洲旭电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In many cases, it is required to embed larger-sized metal heat-conducting parts to achieve rapid heat dissipation of components. However, due to the conductive properties of metal heat-conducting parts, conductive lines can only be made on the insulating substrate of the circuit board. When the size of the component is large, it will not only affect the surface wiring of the circuit board, but also cause a significant increase in the area of ​​the circuit board, which is not conducive to the miniaturization of the circuit board

Method used

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  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] like figure 1 As shown, the circuit board of Embodiment 1 includes an insulating substrate 10 and an aluminum or aluminum alloy heat conducting member 20 that penetrates the insulating substrate 10. The bottom surface of the insulating substrate 10 (that is, the bottom surface of the circuit board) can be provided with a heat dissipation metal layer 40, aluminum or The bottom surface of the aluminum alloy heat conducting element 20 is thermally connected to the heat dissipation metal layer 40 .

[0043] In the present invention, the insulating substrate 10 includes a multi-layer insulating core board 11 , and the multi-layer insulating core boards 11 and between the insulating substrate 10 and the aluminum or aluminum alloy heat conducting member 20 are bonded and connected by a prepreg 12 . Among them, the aluminum or aluminum alloy heat conducting element 20 is preferably an aluminum-silicon alloy heat conducting element, such as a 4045 or 4047 aluminum-silicon alloy ...

Embodiment 2

[0054] like Image 6 As shown, the circuit board of Embodiment 2 includes an insulating substrate 10 and an aluminum or aluminum alloy heat conducting member 20 embedded in the insulating substrate 10 . Wherein, the insulating substrate 10 includes a multi-layer insulating core board 11 , the multi-layer insulating core boards 11 are bonded and connected by a prepreg 121 , and the insulating substrate 10 and the aluminum or aluminum alloy heat conducting member 20 are bonded and connected by a plugging resin 122 . For other descriptions of the structure of the circuit board in Embodiment 2, reference may be made to Embodiment 1 above, and details are not repeated here.

[0055] In embodiment 2, the insulating core board 11 and the prepreg 121 are first pressed together to produce the insulating substrate 10, and the top surface and the bottom surface of the insulating substrate 10 all have a copper foil layer 111; Figure 7 As shown, the insulating substrate 10 is subjected t...

Embodiment 3

[0057] like image 3 As shown, the circuit board of Example 3 includes an insulating substrate 10 and an aluminum or aluminum alloy heat conducting member 20 embedded in the insulating substrate 10, and the top and bottom surfaces of the aluminum or aluminum alloy heat conducting member 20 have an oxide insulating layer 21 and a heat conducting bump. platform 22 , and the top and bottom surfaces of the circuit board both have conductive lines 30 formed on the surface of the insulating substrate 10 and the surface of the oxide insulating layer 21 . For other descriptions of Embodiment 3, reference may be made to the aforementioned Embodiment 1 and Embodiment 2, and details are not repeated here.

[0058] The technical features in each embodiment of the present invention can be combined or replaced with each other. In the present invention, an oxidized insulating layer and a heat conduction boss are formed on the surface of the aluminum or aluminum alloy heat conduction member,...

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Abstract

An embodiment of the invention discloses a circuit board and a preparation method thereof. The circuit board comprises an insulating substrate, a conductive circuit and an aluminum or aluminum alloy heat conduction piece penetrating through the insulating substrate. At least one surface of the aluminum or aluminum alloy heat conduction piece is provided with an aluminum anodic oxidation insulating layer and a heat conduction boss, and the heat conduction boss is exposed out of the aluminum anodic oxidation insulating layer. Resin is filled in pores of the aluminum anodic oxidation insulating layer, and the conductive circuit is formed on the surfaces of the aluminum anodic oxidation insulating layer and the insulating substrate. According to the circuit board, the aluminum anodic oxidation insulating layer and the heat conduction boss are formed on the surface of the aluminum or aluminum alloy heat conduction piece, so that the surface of the circuit board has a relatively large wiring area while the heat dissipation performance is improved, and miniaturization of the circuit board is facilitated; and the pores of the aluminum anodic oxidation insulating layer are filled with resin, so that the electrical insulation property of the aluminum anodic oxidation insulating layer and the binding force between the aluminum anodic oxidation insulating layer and a conductive circuit are enhanced.

Description

technical field [0001] The invention relates to the field of circuit boards; more specifically, it relates to a circuit board in which aluminum or aluminum alloy heat conducting parts are embedded in an insulating substrate and a preparation method thereof. Background technique [0002] In the prior art, a metal heat conduction element is usually embedded in the component installation position of the circuit board, and the metal heat conduction element can be set to penetrate the insulating substrate of the circuit board, thereby forming a heat conduction channel through the insulating substrate, and realizing rapid heat dissipation of the components. [0003] In many cases, it is required to embed larger-sized metal heat-conducting parts to achieve rapid heat dissipation of components. However, due to the conductive properties of metal heat-conducting parts, conductive lines can only be made on the insulating substrate of the circuit board. When the size of the component is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/021H05K1/0204H05K1/0296H05K1/02H05K3/00H05K3/0044
Inventor 李保忠
Owner 珠海洲旭电子有限公司