Printed circuit board manufacturing method based on selective chemical gold process
A technology for printed circuit boards and production methods, applied in the directions of printed circuits, printed circuit manufacturing, and printed circuit secondary processing, can solve the problems of slow production efficiency, unstable quality, long production process, etc., and achieve strong automation operability , avoid processing and pollution, save ink waste effect
Pending Publication Date: 2021-12-31
JIANGSU BOMIN ELECTRONICS
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Problems solved by technology
[0007] Among them, the quality of the selected dry film process is stable but the cost is high, which discourages most board manufacturers; the baking type and exposure type selection cost is low but the quality is unstable, and it is prone to separation or exposed copper to cause gold on the selection area; In addition, the production process of these three production processes is very long, and there are many types of machines used, the production efficiency is slow and the automation is very difficult
Method used
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Embodiment Construction
[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0028] In describing the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", "TOP plane", "BOT plane" etc. indicate orientation Or the positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a spe...
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Abstract
The invention discloses a printed circuit board manufacturing method based on a selective chemical gold process. The method comprises the following steps: cleaning and roughening the surface of a circuit board; respectively and uniformly spraying selective ink layers on the TOP surface and the BOT surface of the circuit board, and curing the ink by utilizing UV light while jet printing the ink; performing chemical gold plating; and stripping the selective ink on the surface of the circuit board. According to the method, the process of selective ink jet printing is adopted to replace the conventional process of silk screening, pre-baking, exposure and developing, the production process is shortened by 2-3 compared with the conventional process in the industry, the cost of materials, water, electricity and labor is reduced, the production efficiency is also improved, and the L / T can be increased by at least one day; during jet printing, only the area covered by the solder resist needs to be subjected to jet printing, so that unnecessary ink waste is saved; exposure and development are replaced by a jet printing process, so that treatment and pollution of development liquid medicine are avoided, and green manufacturing is realized; and according to the printed circuit board manufacturing method based on the selective chemical gold process, the manufacturing process can be optimized, and the production efficiency can be improved.
Description
technical field [0001] The invention belongs to the technical field of PCB production, in particular to a method for producing a printed circuit board based on a selective gold process. Background technique [0002] Selective Gold process (Selective Gold) is referred to as Selective Gold, which is Entek+OSP (Entek+ImmersionGold). Because part of the surface treatment method is chemical gold treatment, and some areas are Entek, it is called selective chemical gold. [0003] Selective gold production process, the two most commonly used processes in the industry are: selective wet film process and selective dry film process, these two processes are generally divided into three processes: [0004] 1) Selective dry film process: pre-treatment board surface cleaning → selective dry film lamination → selective dry film exposure → selective dry film development → chemical gold → selective dry film removal; [0005] 2) Baking-type selection process: pre-treatment board surface clea...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/24H05K3/28H05K3/26
CPCH05K3/24H05K3/28H05K3/288H05K3/26
Inventor 毛永胜孙炳合盛利召覃新冷亚娟
Owner JIANGSU BOMIN ELECTRONICS