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Preparation method of spherical silica powder capable of reducing reject ratio of IC (integrated circuit) packaging

A technology of spherical silicon micropowder and silicon micropowder, which is applied in the field of thermally conductive fillers, can solve the problems of limitation and high defect rate of spherical silicon micropowder IC packaging, and achieve the effects of high filling volume, reduced IC defect rate and high purity

Active Publication Date: 2022-01-04
联瑞新材(连云港)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the defect rate of IC packaging of spherical silica powder prepared by this method is still high, which limits its further application.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Step 1: Heat and spheroidize the commercially available angular silica powder with an average particle diameter of 19 μm at 1800-1900° C. to obtain spherical silica powder 1-1, 1-2, and the average particle diameters of 1-1 and 1-2 are respectively 34μm, 2μm;

[0031] Step 2: Heat and spheroidize commercially available angular silica powder with an average particle size of 10 μm at 2000-2100°C to obtain spherical silica powders 1-3, 1-4, 1-3, and 1-4 with an average particle diameter of 12μm, 0.3μm;

[0032] Step 3: Spherical silicon micropowder 1-1, 1-3 are respectively heat-treated at 200°C, then subjected to coarse classification to remove large particles and agglomerates, and then undergo precise sieving to completely remove large particles and agglomerates to obtain 1-5, 1 -6, 1-5, and 1-6 have an average particle size of 31 μm and 11 μm, respectively;

[0033] Step 4: According to the feeding sequence of 1-6, 1-2, 1-5, 1-4, the mass fractions of 1-6, 1-2, 1-5, 1...

Embodiment 2

[0035] Step 1: Heat and spheroidize commercially available angular silica powder with an average particle diameter of 22 μm at 1900-2000° C. to obtain spherical silica powder 2-1, 2-2, and the average particle diameters of 2-1 and 2-2 are respectively 35μm, 2.5μm;

[0036] Step 2: Heat and spheroidize the commercially available angular silica powder with an average particle diameter of 12 μm at 2100-2200° C. to obtain spherical silica powder 2-3, 2-4, and the average particle diameters of 2-3 and 2-4 are respectively 15μm, 0.5μm;

[0037] Step 3: Spherical silicon micropowder 2-1 and 2-3 are respectively heat-treated at 250°C, then undergo coarse classification to remove large particles and agglomerates, and then undergo precise sieving to completely remove large particles and agglomerates to obtain 2-5, The average particle sizes of 2-6, 2-5, and 2-6 are 33 μm and 13 μm, respectively;

[0038] Step 4: According to the feeding order of 2-6, 2-2, 2-5, 2-4, the mass fractions ...

Embodiment 3

[0040] Step 1: Heat and spheroidize commercially available angular silica powder with an average particle diameter of 25 μm at 2000-2100° C. to obtain spherical silica powder 3-1, 3-2, and the average particle diameters of 3-1 and 3-2 are respectively 43μm, 3.5μm;

[0041] Step 2: Heat and spheroidize the commercially available angular silica powder with an average particle diameter of 14 μm at 2300-2400° C. to obtain spherical silica powder 3-3, 3-4, and the average particle diameters of 3-3 and 3-4 are respectively 16μm, 0.7μm;

[0042] Step 3: Spherical silicon micropowder 3-1 and 3-3 are respectively heat-treated at 150°C, then undergo coarse classification to remove large particles and agglomerates, and then undergo precise sieving to completely remove large particles and agglomerates to obtain 3-5 and 3 -6, 3-5, and 3-6 have an average particle size of 38 μm and 15 μm, respectively;

[0043] Step 4: According to the feeding order of 3-6, 3-2, 3-5, 3-4, the mass fractio...

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PUM

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Abstract

The invention discloses a preparation method of spherical silica powder capable of reducing the reject ratio of IC (integrated circuit) packaging. The method comprises the following steps of: respectively heating and spheroidizing angular silicon micro-powder A1 and A2 with different particle sizes to obtain spherical silicon micro-powder Q1, Q2, Q3 and Q4 with different particle sizes, heating the spherical silicon micro-powder Q1 and Q3, carrying out coarse classification to remove large particles and agglomerates, carrying out precise screening to thoroughly remove large particles and agglomerates to obtain Q5 and Q6, and finally, mixing and homogenizing according to the feeding sequence of Q6, Q2, Q5 and Q4 in proportion to obtain high-filling and low-agglomeration spherical silica powder. The spheroidization rate of the prepared spherical silica powder is 95% or above, the spherical silica powder has high purity, high filling amount and high fluidity, the reject ratio of IC packaging can be effectively reduced, and the spherical silica powder can be widely applied to the fields of insulating materials, electronic materials and the like.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive fillers, and relates to a method for preparing spherical silicon micropowder which reduces the defect rate of IC packaging. Background technique [0002] With the development trend of light weight, miniaturization and diversified functions in the microelectronics industry, IC packaging technology puts forward stricter quality control requirements for spherical silicon micropowder. Through continuous improvement of IC packaging technology, the defect rate of IC packaging is basically Maintained at about 10ppm, and one of the important reasons why the defective rate of IC packaging cannot be further improved is the content and size of large particles and agglomerates in spherical silica powder. Further reducing the content of large particles and aggregates in spherical silica powder can Reduce the probability of plugging of the injection port or defective packaging during IC packaging, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/18C09C1/30C09C3/04C09K5/14
CPCC01B33/18C09K5/14C09C1/3009C09C3/04C01P2006/80C01P2004/61C01P2004/62C01P2004/32
Inventor 林铭曹家凯郭家文王素琴王凡
Owner 联瑞新材(连云港)有限公司