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MEMS structure and manufacturing method thereof

A manufacturing method and electrode layer technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of reduced sensitivity, large pulling force of the diaphragm, noise, etc.

Pending Publication Date: 2022-01-04
ANHUI ORINFIN ACOUSTIC SCI&TECH CO LTD
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  • Application Information

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Problems solved by technology

During the preparation process, the size of the upper dielectric layer is smaller than the size of the diaphragm, which causes the diaphragm to be subjected to a very large pulling force, and the flatness of the diaphragm becomes poor. Such a diaphragm will generate some noise during operation, resulting in a decrease in sensitivity

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  • MEMS structure and manufacturing method thereof
  • MEMS structure and manufacturing method thereof
  • MEMS structure and manufacturing method thereof

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in this application belong to the protection scope of this application.

[0031] see figure 1 , according to an embodiment of the present application, a MEMS structure is provided, the MEMS structure can be applied to a sensor, such as a microphone, and can also be applied to an actuator, such as a speaker. The MEMS structure includes a substrate 10 , a vibration support layer 40 , a first electrode layer 50 , a piezoelectric layer 60 , a second electrode layer 70 and a buffer 30 . The manufacturing method and specific structure of the MEMS structure will be introduced in detail below.

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Abstract

The invention discloses an MEMS structure, and the structure comprises a substrate which is provided with a cavity; a vibration support layer formed over the substrate and covering the cavity; a first electrode layer formed over the vibration support layer and suspended over the cavity; a piezoelectric layer formed over the first electrode layer; a second electrode layer formed over the piezoelectric layer; and a buffer member extending from an upper surface of the vibration support layer to a lower surface of the vibration support layer, the buffer member being located at a periphery of the first electrode layer, the piezoelectric layer, and the second electrode layer, and suspended above the cavity. In the MEMS structure, the buffer part is arranged at the peripheries of the first electrode layer, the piezoelectric layer and the second electrode layer, which is equivalent to reinforcing the peripheral areas of the first electrode layer, the piezoelectric layer and the second electrode layer, so that the flatness of the vibration supporting layer is increased, and the reliability and the stability of the MEMS structure are further improved. And the sensitivity and the signal-to-noise ratio of the MEMS structure are improved.

Description

technical field [0001] The present application relates to the technical field of acoustic-electric conversion devices, and in particular, relates to a MEMS (Micro-Electro-Mechanical System, micro-electro-mechanical system) structure and a manufacturing method thereof. Background technique [0002] MEMS piezoelectric microphone is a microphone prepared by microelectromechanical system technology and piezoelectric thin film technology. The sensitivity of the microphone is closely related to the flatness of the diaphragm. The flatness of the diaphragm is related to the shape of the upper and lower dielectric layers of the diaphragm. During the preparation process, the size of the upper dielectric layer is smaller than the size of the diaphragm, which causes the diaphragm to be subjected to a very large pulling force, and the flatness of the diaphragm becomes poor. Such a diaphragm will generate some noise during operation, resulting in a decrease in sensitivity. Therefore, it...

Claims

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Application Information

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IPC IPC(8): H04R19/04H04R31/00B81B3/00B81C1/00
CPCH04R19/04H04R31/00B81B3/0064B81C1/00642H04R2400/11B81B2201/0257
Inventor 夏永禄刘端
Owner ANHUI ORINFIN ACOUSTIC SCI&TECH CO LTD
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