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Wafer machining device

A technology for processing devices and wafers, applied in the direction of grinding drive devices, metal processing equipment, manufacturing tools, etc., can solve the problems of small application range and low polishing efficiency, and achieve the effect of wide application range and high polishing efficiency

Pending Publication Date: 2022-01-11
熊伟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of small application range and low polishing efficiency in the prior art, and propose a wafer processing device

Method used

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  • Wafer machining device
  • Wafer machining device
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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0028] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0029] refer to Figure ...

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PUM

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Abstract

The invention discloses a wafer machining device comprising a plurality of machining mechanisms. Each machining mechanism comprises a U-shaped plate, the lower end of each U-shaped plate is fixedly connected with a disc, the lower end of each disc is fixedly connected with two vertical plates, and two clamping plates are arranged between every two corresponding vertical plates. An adjusting mechanism used for adjusting the corresponding two clamping plates is arranged between every two corresponding vertical plates, an adjusting plate is arranged between every two corresponding vertical plates, a first motor is fixedly connected to the upper end of each disc, a driving shaft of each first motor rotationally penetrates through the corresponding disc, and a sliding rod is coaxially and fixedly connected to the upper end of each adjusting plate. The driving shaft of each first motor is slidably connected with the corresponding sliding rod, each sliding rod is sleeved with a sliding sleeve, the lower end of each sliding sleeve is rotatably connected with the upper end of the corresponding adjusting plate, a lifting mechanism used for making the corresponding sliding sleeve to rise and fall is arranged in each disc, and a polishing wheel is arranged below each adjusting plate. The wafer machining device is wide in application range and high in wafer polishing efficiency.

Description

technical field [0001] The invention relates to the technical field of wafer production equipment, in particular to a wafer processing device. Background technique [0002] Silicon is a semiconductor material, and its own conductivity is not very good. However, its resistivity can be precisely controlled by adding appropriate dopants. Before manufacturing semiconductors, silicon must be converted into wafers. The growth of the ingot begins. Monocrystalline silicon is a solid in which atoms are periodically formed in a three-dimensional spatial pattern. This pattern runs through the entire material. Polycrystalline silicon is formed separately from many small single crystals with different crystal orientations. It cannot be used to make semiconductor circuits. Polycrystalline silicon must be melted It takes anywhere from a week to a month to process a silicon wafer into a single ingot, depending on many factors, including size, quality, and end-user requirements. [0003] Wh...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B27/00B24B41/04B24B41/06B24B47/00B24B47/12B24B47/16
CPCB24B29/02B24B27/0076B24B27/0023B24B41/04B24B41/06B24B47/12B24B47/16B24B47/00
Inventor 熊伟
Owner 熊伟