Flow guide device

Abstract

The invention provides a flow guide device. The flow guide device is applied to silicon rod slicing equipment. The silicon rod slicing equipment comprises a guide wheel used for winding a diamond wire and a motor used for controlling the guide wheel to rotate. The flow guide device comprises a flow guide plate and a driving mechanism; the flow guide plate is provided with a liquid outlet end for outputting cooling liquid and used for providing the cooling liquid for the diamond wire; and the driving mechanism is connected with the flow guide plate so as to obtain the torque value of the guide wheel driven by the motor, and the rotating angle of the flow guide plate in the circumferential direction is controlled according to the torque value so as to adjust the height of the liquid outlet end in the vertical direction. According to the flow guide device, the torque value of the guide wheel driven by the motor is obtained in real time, the rotating angle of the guide plate in the circumferential direction is controlled according to the torque value, the cooling liquid always flows to the contact point of the diamond wire and a silicon rod, the difference value of the maximum thickness and the minimum thickness of a silicon wafer, the wire mark rate and the diamond wire breakage rate are effectively reduced, the surface quality of the silicon wafer is improved, automatic control is also realized, the frequency of manual adjustment is reduced, and the labor intensity is effectively reduced.

Description

Technical field [0001] The present invention relates to the field of silicon production techniques, and more particularly to a fluid flow device. Background technique [0002] In the existing silicon production technology, the diamonds are often used to cut silicon sheets. With the development of technology, the diamond lines are more thin, and the thickness of the silicon wafer is getting thinner, and the silicon sizes are also getting bigger. Since the currently used coolant guide plate is disposed at a fixed position, the fall of the coolant is always in a fixed position, while the silicon cutting process, with the change of the diamond line bow, leading to the surface of the silicon wafer and The abnormal conditions such as the migrant line disconnection are gradually increased, so it is necessary to manually adjust the cooling liquid to ensure that the coolant is fully involved, and this way is expensive, and the risk of silicon line marks and Diamond line is not allowed. . ...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a method to solve the problem that the position of the deflector is fixed and the coolant cannot be accurately delivered to the contact point between the diamond wire and the silicon rod.

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