Method, device and equipment for calculating wafer period in wafer
A computing method and technology in wafers, applied in computing, image data processing, instruments, etc., can solve problems such as slow computing speed and long time consumption, and achieve the effect of increasing speed and stability, increasing adaptability, and reducing manual intervention.
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[0065] The present invention is further detailed below with reference to the accompanying drawings and examples. It will be appreciated that the specific embodiments described herein are merely illustrative of the invention and are not limited thereto. It will also be also to be described, and only the parts associated with the present invention are shown in the drawings rather than all structures.
[0066] A plurality of wafers (DIE) having an array arranged on the wafer, and there is a groove between the wafer and the wafer, and the wafer is typically rectangular. After the wafer is formed on the wafer, it is necessary to detect whether the wafer is defective by the machine vision. At this time, the cycle between the wafer is required to set the machine vision. Motion path. In the prior art, the cycle between the wafers is generally obtained in the artificial manner, the efficiency is low, and the time is long.
[0067] To this end, the embodiment of the present invention propos...
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