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Three-dimensional packaging structure of on-chip integrated filter and packaging method thereof

An integrated filter and three-dimensional packaging technology, which is applied in the manufacture of electric solid-state devices, semiconductor devices, and semiconductor/solid-state devices, etc. The effect of high control precision

Pending Publication Date: 2022-01-14
CHENGDU GANIDE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The traditional integrated packaging methods in RF electronic systems are mainly based on LTCC (low temperature co-fired ceramics) or other laminated materials. For the integration of filters, surface mount technology is often used for assembly, and the accuracy, size and integration are difficult to meet the needs of miniaturization.

Method used

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  • Three-dimensional packaging structure of on-chip integrated filter and packaging method thereof
  • Three-dimensional packaging structure of on-chip integrated filter and packaging method thereof
  • Three-dimensional packaging structure of on-chip integrated filter and packaging method thereof

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Embodiment Construction

[0037] The specific embodiments of the present invention are described below so that those skilled in the art can understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes Within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions and creations using the concept of the present invention are included in the protection list.

[0038] With the improvement of integration, there is a requirement for the size of the filter in the system to be further reduced under the premise of satisfying the performance, and the multilayer filter also appears. The present invention provides a filter on a silicon or glass substrate The three-dimensional packaging structure of the integrated filter is naturally compatible with the chip in terms of size, material, proc...

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Abstract

The invention discloses a three-dimensional packaging structure of an on-chip integrated filter. The three-dimensional packaging structure comprises an upper packaging plate and a lower packaging plate which are stacked, and the on-chip integrated filter arranged on the upper surface of the lower packaging plate. The filter is integrated while the system is integrated, the integrated filter process is compatible with the adapter plate process, one-time processing forming can be realized, the integration process is simplified, three-dimensional integrated packaging is realized, and the problems of poor packaging and integration consistency and difficulty in miniaturization of a traditional radio frequency system are solved.

Description

technical field [0001] The invention relates to, in particular, to a three-dimensional packaging structure of an on-chip integrated filter and a packaging method thereof. Background technique [0002] The filter structure is an indispensable part of the electronic system. Under the background of miniaturization and miniaturization of the electronic system, the application and development of microsystem technology put forward new requirements for the system integration method. For the key structural filter, not only the Good performance, small size, and it must be compatible with microsystem integration packaging technology in terms of size, material, packaging, etc., and easy to integrate with microsystems. The traditional integrated packaging methods in RF electronic systems are mainly based on LTCC (low temperature co-fired ceramics) or other laminated materials. For the integration of filters, surface mount technology is often used for assembly. The accuracy, size and int...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L21/56H01L21/768H01L23/31H01L23/48H03H1/00
CPCH01L21/76898H01L21/56H01L23/481H01L23/3128H01L25/16H03H1/00H03H2001/0085
Inventor 胡柳林唐小宏何舒玮陈依军卢朝保侯杰周鹏吴晓东袁野唐仲俊董金生
Owner CHENGDU GANIDE TECH
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