Three-dimensional packaging structure of on-chip integrated filter and packaging method thereof

Abstract

The invention discloses a three-dimensional packaging structure of an on-chip integrated filter. The three-dimensional packaging structure comprises an upper packaging plate and a lower packaging plate which are stacked, and the on-chip integrated filter arranged on the upper surface of the lower packaging plate. The filter is integrated while the system is integrated, the integrated filter process is compatible with the adapter plate process, one-time processing forming can be realized, the integration process is simplified, three-dimensional integrated packaging is realized, and the problems of poor packaging and integration consistency and difficulty in miniaturization of a traditional radio frequency system are solved.

Description

technical field [0001] The invention relates to, in particular, to a three-dimensional packaging structure of an on-chip integrated filter and a packaging method thereof. Background technique [0002] The filter structure is an indispensable part of the electronic system. Under the background of miniaturization and miniaturization of the electronic system, the application and development of microsystem technology put forward new requirements for the system integration method. For the key structural filter, not only the Good performance, small size, and it must be compatible with microsystem integration packaging technology in terms of size, material, packaging, etc., and easy to integrate with microsystems. The traditional integrated packaging methods in RF electronic systems are mainly based on LTCC (low temperature co-fired ceramics) or other laminated materials. For the integration of filters, surface mount technology is often used for assembly. The accuracy, size and int...

AI Technical Summary

Problems solved by technology

The traditional integrated packaging methods in RF electronic systems are mainly based on LTCC (low temperature co-fired ceramics) or other laminated materials. For the integration of filters, surface mount technology is often used for assembly, and the accuracy, size and integration are difficult to meet the needs of miniaturization.

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