A kind of diode packaging method
A packaging method and diode technology, applied in the field of diodes, can solve problems such as increased production cost, blocked suction force of suction nozzles, and insufficient suction, and achieve the effects of saving costs, improving production efficiency, and improving speed.
Active Publication Date: 2022-07-29
深圳市美丽微半导体有限公司
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Problems solved by technology
[0004] The invention provides a diode packaging method, which is used to solve abnormalities such as chip rotation, offset, material drop, etc., and the size of the suction nozzle is in order to meet the size of the chip. Insufficient problem, which leads to waste of production efficiency and increase of production cost
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[0054] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.
[0055] as attached figure 1 As shown, the present invention is a diode packaging method, comprising:
[0056] Spray encapsulation glue material in the groove of the substrate to fix the first electrode and the second electrode;
[0057] An insulating layer is arranged on the front side of the substrate, and the light-emitting diode chip is packaged in the insulating layer;
[0058] A circuit layer is provided on the insulating layer, and the first electrode and the second electrode are led out through the circuit layer.
[0059] The working principle of the above technical solution is as follows: when the present invention is packaged, the package is mainly performed by splici...
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The invention provides an energy-saving and high-efficiency diode packaging method and a diode. Spray encapsulation glue in the groove of the substrate to fix the first electrode and the second electrode; set an insulating layer on the front of the substrate, and encapsulate the light-emitting diode chip into the first insulating layer; set on the insulating layer The circuit layer, the first electrode and the second electrode are led out through the circuit layer. The substrate of the invention is provided with grooves, and the electrodes can be fixed by directly spraying glue material. The insulating layer directly contains the light-emitting diode chip to prevent the chip from being damaged or offset, and the final circuit layer leads the electrode out, and at the same time, it can also form a certain protection for the electrode. The beneficial effects are: using the mold as the carrier of the package, there is no need to have too much operation on the package substrate, and the cost can be saved. The presence of circuit layers allows multiple common electrical lines to be printed at the same time, improving the speed of process production. The fabricated package structure can be directly onboarded by SMT, thereby improving production efficiency.
Description
technical field [0001] The present invention relates to the technical field of diodes, and in particular, to a diode packaging method. Background technique [0002] At present, the traditional packaging method of light-emitting diodes is to connect the electrodes of the light-emitting diodes and the packaging substrate by wire bonding. Since it needs to be wire-bonded one by one, for the application requirements of multi-chips, there will be The production speed and yield cannot meet the requirements; and the wire bonding method is difficult to reduce in size, and the impedance is high, and it is difficult to meet the application requirements of light, thin, small and high brightness. [0003] In the prior art, the chip needs to be precisely positioned and placed at the designated position of the packaging substrate. However, as the chip size of the light-emitting diode is getting smaller and smaller, it leads to poor stability of picking up the chip and transferring it. Ab...
Claims
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IPC IPC(8): H01L33/52H01L33/48H01L33/62H01L21/56
CPCH01L33/52H01L33/48H01L33/62H01L21/565H01L2933/005H01L2933/0066
Inventor 张成刚
Owner 深圳市美丽微半导体有限公司