Packaging method of photovoltaic bypass module

Abstract

The invention provides a packaging method of a photovoltaic bypass module. The packaging method comprises the following steps: providing a lead frame, an MOS chip, an IC chip and a capacitor; mounting a chip, and fixing the MOS chip, the IC chip and the capacitor on the base island of the anode pin; bonding: bonding the MOS chip, the IC chip and the capacitor by adopting a copper wire or a gold wire, and bonding the MOS chip and the cathode pin by adopting an aluminum strip; performing cleaning; performing plastic packaging; conducting tinning; and cutting ribs, testing and printing, and packaging and delivering. Through the multi-row frame units, the production efficiency can be effectively improved, and the production cost is reduced; in the packaging process, the chips and the chips and the capacitors are bonded through copper wires or gold wires, the on-resistance can be reduced by 20%-30%, and the reliability of welding spots is improved; the MOS chip and the cathode pin are bonded by adopting an aluminum strip, so that the on-resistance can be reduced by 10%-20%, the conduction loss is reduced, and the current impact resistance is improved; and a wider aluminum strip is used for bonding, so that the thermal resistance can be effectively reduced by 20%-30%, and the heat conduction capability is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a packaging method for a photovoltaic bypass module. Background technique [0002] Photovoltaic power generation is the conversion of inexhaustible light energy into electrical energy. Pure and pollution-free light energy is more in line with the development of our era, but how to convert more light energy into electrical energy and how to avoid the conversion of electrical energy Being wasted has become an unavoidable problem. The conversion efficiency mainly depends on the efficiency of the solar panel material to convert light energy into electrical energy, while the power loss is affected by the hot spot effect, and the severe hot spot effect may even damage the entire solar battery pack. Although the hot spot effect is inevitable, we can minimize the impact of the hot spot effect by adding a photovoltaic bypass circuit. [0003] The photovoltaic bypass circuit can b...

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a packaging method for photovoltaic bypass modules, which is used to solve the problem of low heat dissipation efficiency, large power consumption, and easy failure when packaging photovoltaic bypass module devices in the prior art. , problems affecting the performance of power devices

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