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Outer-layer gasket tin plating equipment for conductive silicon wafer production

A technology of tinning equipment and silicon wafers, applied in welding equipment, metal processing equipment, auxiliary devices, etc., can solve the problems of low production efficiency of manual tinning, achieve the effect of avoiding wear and ensuring production quality

Inactive Publication Date: 2022-02-11
朱铁红
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcoming of low production efficiency of artificial tinning in the prior art, and propose a kind of tinning equipment for outer layer gaskets used in the production of conductive silicon wafers

Method used

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  • Outer-layer gasket tin plating equipment for conductive silicon wafer production
  • Outer-layer gasket tin plating equipment for conductive silicon wafer production
  • Outer-layer gasket tin plating equipment for conductive silicon wafer production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] refer to Figure 2-3 , an outer gasket tinning device for producing conductive silicon wafers, comprising a base 1,

[0032] A conveying mechanism 2, the conveying mechanism 2 is installed on the top of the base 1 to convey the conductive silicon wafer;

[0033] The mounting frame 3 is fixedly installed on the top of the base 1;

[0034] Transfer mechanism 4, transfer mechanism 4 is installed on the mounting frame 3, to transfer conductive silicon wafer; Between the installation frame 3 and the base 1, the turntable 41 is fixedly installed on the rotating shaft 42, and the rotating shaft 42 is used for the rotation of the turntable 41; driving a number of cylinders 43 is fixedly installed on the top of the turntable 41, and is evenly distributed around the turntable 41. The holding assemblies 44 are respectively fixedly installed on the output ends of the corresponding cylinders 43, and are located below the turntable 41, and the drive assembly 45 is installed on the ...

Embodiment 2

[0046] In Embodiment 1, the winding coil inside the electromagnet 444 needs an external power supply wire. Since the electromagnet 444 needs to follow the rotation of the turntable 41, the external power supply wires are entangled with each other, which affects later maintenance;

[0047] refer to Figure 2-6 , as another preferred embodiment of the present invention, the difference from Embodiment 1 is that the top of the installation frame 3 is equipped with an electromagnetic energization mechanism 5 corresponding to the electromagnet 444, and the electromagnetic energization mechanism 5 includes an installation box 51, a fixed seat 52 , a power supply assembly 57, a number of first electrode pieces 53, a number of conductive blocks 54 and a number of cable wires 55, the installation box 51 is fixedly installed on the mounting frame 3, the fixing seat 52 is fixedly installed on the top of the rotating shaft 42, and some first electrode pieces 53 is evenly and fixedly instal...

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Abstract

The invention belongs to the technical field of silicon wafer production equipment and relates to outer-layer gasket tin plating equipment for conductive silicon wafer production. The outer-layer gasket tin plating equipment comprises a base, a conveying mechanism, a mounting rack, a transfer mechanism, a tin liquid tray, a collecting frame and a control box; the conveying mechanism is mounted at the top of the base to convey conductive silicon wafers; the mounting rack is fixedly mounted at the top of the base; the transfer mechanism is mounted on the mounting rack so as to transfer the conductive silicon wafers; the tin liquid tray is fixedly installed on the top of the base and located below the transfer mechanism; the collecting frame is fixedly installed on the top of the base and located below the transfer mechanism; and the control box is fixedly installed on the top of the mounting rack so as to control starting and stopping of the conveying mechanism and the transfer mechanism. According to the outer-layer gasket tin plating equipment for the conductive silicon wafer production of the invention, the outer layers of the silicon wafers are prevented from being abraded by directly clamping the silicon wafers on the conveying mechanism by clamping jaws, so that the production quality of the silicon wafers is ensured.

Description

technical field [0001] The invention relates to the technical field of silicon wafer production equipment, in particular to an outer-layer gasket tinning equipment for conductive silicon wafer production. Background technique [0002] Diodes are the core electronic components in electronic circuits; diodes are a device with two electrodes that only allow current to flow in one direction; all of the above electronic components need to be equipped with semiconductor silicon chips, because silicon chips cannot directly pass through tin liquid It is connected with the circuit, so the existing silicon chip is mainly fixed by setting the upper and lower metal gaskets, such as figure 1 As shown, the bottom and top of the silicon wafer 101 are respectively fixedly installed with the first gasket 101 and the second gasket 102, and then are fixed by tin-plating on the outer layer of the first gasket 101 and the second gasket 102, and finally through the first gasket 101 and the second...

Claims

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Application Information

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IPC IPC(8): B23K3/00B23K3/08
CPCB23K3/00B23K3/08
Inventor 朱铁红
Owner 朱铁红