Half-etching equipment for integrated circuit lead frame

Abstract

The invention relates to the technical field of lead frame semi-etching, in particular to semi-etching equipment for an integrated circuit lead frame. The equipment comprises a shell, water storage tanks are fixedly communicated with the two sides of the shell, water pumps are fixed in the water storage tanks, and the water outlet ends of the water pumps are fixedly communicated with spraying pipes through guide pipes. The spraying pipes are fixed between the inner walls of the shell, a plurality of sprayers fixedly communicate with the outer wall of the spraying pipe, guide rails are symmetrically fixed to the two sides of the inner wall of the shell, and sliding strips are slidably connected into the guide rails, wherein a driving mechanism used for driving the sliding strips to slide in the guide rails is arranged on one side of one sliding strip, and a supporting plate is arranged between the two sliding strips. According to the scheme, after etching is completed, the lead frame is driven to rotate through the turnover mechanism, so the etching liquid in the groove is turned over and falls, the etching liquid on the surface of the lead frame can be cleaned in time after etching is completed, and the situation that the etching liquid stays on the surface of the lead frame to continue etching, and the etching depth is large is prevented.

Description

technical field [0001] The invention relates to the field of lead frame half etching, in particular to an integrated circuit lead frame half etching device. Background technique [0002] Etching is also called photochemical etching, which refers to removing the protective film of the area to be etched after exposure plate making and development, and contacting chemical solution during etching to achieve the effect of dissolution and corrosion, forming the effect of concave-convex or hollow molding. When the lead frame is etched or electroplated, some parts need to be covered, and some parts need to be exposed through windows to enter the next process. [0003] Some invention patents related to lead frame half-etching are disclosed in the prior art. The Chinese patent application number 201920941748.X discloses an etching equipment for a lead frame assembly line, including an etching pool and a bracket. The bracket is located on one side of the etching pool. A guide rail is ...

AI Technical Summary

Problems solved by technology

[0004] Most of the lead frame half-etching equipment in the prior art covers the parts that do not need to be etched by dry film development or manual tape application, but dry film development is prone to exposure deviation, excessive development or unclean development. The way of sticking the tape is poor in precision and slow in efficiency, and does not have a protective effect. After the etching is completed, it is difficult for the existing equipment to clean the etchant on the lead frame in time, resulting in a deep etching depth. In view of this, we A half-etching equipment for integrated circuit lead frame is proposed

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