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Circuit board, arrangement and connection method thereof, electronic equipment and computing system

A connection method and technology of electronic equipment, applied in the direction of circuit devices, electrical connection printed components, printed circuits, etc., can solve the problems of reduced power transmission performance and large connection impedance, and achieve the effect of reducing connection impedance and improving power transmission performance

Pending Publication Date: 2022-02-22
NVIDIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] But for very high power module boards and miniaturized module boards, due to the board-to-board connection, the contact between the board and the board will introduce additional impedance, resulting in a large connection impedance on the current path, resulting in power transfer reduced performance

Method used

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  • Circuit board, arrangement and connection method thereof, electronic equipment and computing system
  • Circuit board, arrangement and connection method thereof, electronic equipment and computing system
  • Circuit board, arrangement and connection method thereof, electronic equipment and computing system

Examples

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Embodiment 1

[0035] This embodiment provides a circuit board. see figure 1 , figure 1 A schematic layout diagram of a circuit board 10 according to an embodiment is shown. Wherein, the circuit board 10 may be communicatively connected with another circuit board (not shown) for power delivery and information transfer. Exemplarily, the circuit board 10 and another circuit board can be various types of circuit boards, such as ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, wiring boards, printed circuit boards (PCBs), aluminum Substrates, high-frequency boards, thick copper boards, ultra-thin circuit boards, etc., are not limited in the present invention. Exemplarily, the circuit board 10 may be any module board known in the art, such as a high-power module board (eg, an engine card, a graphics card, etc.), and the other circuit board may be a main board. Exemplarily, the circuit board 10 may be a main board, and another circuit board may b...

Embodiment 2

[0052] This embodiment provides a circuit board arrangement and connection method. Among other things, the circuit board can be communicatively connected to another circuit board for power transfer and information transfer. Exemplarily, the circuit board and the other circuit board may be various types of circuit boards, such as ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, wiring boards, printed circuit boards (PCBs), Aluminum substrates, high-frequency boards, thick copper boards, ultra-thin circuit boards, etc., are not limited in the present invention. Exemplarily, the circuit board may be any module board known in the art, such as a high-power module board (for example, an engine card, a graphics card, etc.), and the other circuit board may be a main board. Exemplarily, the circuit board may be a main board, and the other circuit board may be any module board known in the art, such as a high-power module board. Further,...

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PUM

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Abstract

The invention provides a circuit board, an arrangement and connection method thereof, electronic equipment and a computing system. The circuit board has at least one circuit element bonded thereto, the circuit element having at least one element connection through which the circuit element is directly connected to another circuit board. According to the circuit board, the arrangement and connection method of the circuit board, the electronic equipment and the computing system provided by the embodiment of the invention, the circuit elements on the circuit board are directly connected to another circuit board, so that the connection impedance on a current path is remarkably reduced, and the power transmission performance is improved.

Description

technical field [0001] The present invention relates to the field of medical equipment, and more specifically, to a circuit board, an arrangement and connection method thereof, electronic equipment and a computing system. Background technique [0002] For the board system of electronic equipment, there are usually several circuit boards (eg, printed circuit boards (PCBs)) connected to each other, and the circuit boards are connected to each other through connectors, wires, flexible PCBs, etc. for power transmission. For the high-power module board in the circuit board, the key is to get good power delivery performance between the high-power module board and the main board, at this time, ordinary connectors, wires, and flexible PCBs are no longer suitable, so usually a The board is soldered to another board for good supply voltage (VCC) and ground contact. [0003] But for very high power module boards and miniaturized module boards, due to the board-to-board connection, the...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/34H05K1/02
CPCH05K1/115H05K3/3426H05K3/3447H05K1/0251H05K2201/048
Inventor 苏波严明黄明奇
Owner NVIDIA CORP