High-power DC solid-state power controller with integrated radiation structure

Abstract

The invention relates to a high-power DC solid-state power controller with an integrated radiation structure. A shell of the controller integrates a radiator structure and a solder cup structure so as to better radiation effects and realize high sealing performance and anti-electromagnetic interference characteristics. An internal power controller component is completely connected with a heating part (10) by a double-sided ceramic copper-clad plate to form a good radiation path. A kover sleeve is connected with an output leading-out rod to ensure the sealing performance of the controller. The solder cup-shaped kover sleeve reduces difficulties in the sealing assembly of a bottom plate and the output leading-out rod, and also ensures secure connection with the lowest contact resistance between the output leading-out rod and a long diversion bar and between the output leading-out rod and a short diversion bar. A horizontal diversion bar is connected with an output circuit so as to maximally save an internal space and maximally reduce voltage drop on the output circuit. A control circuit is arranged on a circuit board, and is positioned in a central layer of the structure. The overall design of the controller ensures high radiation performance and high sealing performance, and realizes high power density with a small volume.

Description

technical field [0001] The invention relates to a high-power direct-current solid-state power controller, in particular to a high-power direct-current solid-state power controller with integrated heat dissipation structure. Background technique [0002] At present, in electronic equipment with sealing index requirements, when the heat generated by the heating device fills the sealed cavity, high temperature will be formed in the cavity, which will cause problems such as performance degradation or damage of other electronic components inside, which will affect the performance of the equipment. Normal use. Especially for devices with higher power, the problem of heat dissipation is more important. [0003] Therefore, at present, in order to dissipate heat, the method adopted is to install a heat sink with a plurality of cooling fins externally when the equipment is in use, and expand the heat dissipation area through the heat sink to improve the heat dissipation effect of the...

AI Technical Summary

Problems solved by technology

However, additionally installed radiators tend to be bulky and take up a lot of space, making it cumbersome to use the device

And the radiator is suitable for multi-output power controllers. The advantages of single-output power controllers are small size and high power density. It is obviously unreasonable to install additional large-volume radiators for use together.

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