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Feeding device for plate-shaped elements and control method of feeding device

A technology for feeding devices and components, which is applied to conveyor objects, transportation and packaging, etc., can solve the problems of high investment cost, easy to stain ceramic substrates, low working efficiency of ceramic substrates, etc., and achieve the effect of reducing errors.

Active Publication Date: 2022-03-01
XIAMEN AEROSPACE SIERT ROBOT SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the work efficiency of manually placing the ceramic substrate is low, and the investment cost is high, and the manual feeding is very easy to stain the ceramic substrate

Method used

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  • Feeding device for plate-shaped elements and control method of feeding device
  • Feeding device for plate-shaped elements and control method of feeding device
  • Feeding device for plate-shaped elements and control method of feeding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Depend on Figures 1 to 6 As shown, the embodiment of the present invention provides a feeding device for plate-shaped components, including a material storage assembly 2, a jacking assembly 1, a first support base 10, a second support base 21, a positioning assembly 3 and a clamping assembly 4 .

[0061] The material storage assembly 2 includes a material seat 5 . The material seat 5 is provided with a storage tank for placing plate-like components. The bottom of the material seat 5 is provided with a top material through hole communicating with the material storage tank. The jacking assembly 1 is arranged under the material seat 5 and can pass through the material jacking hole to lift the plate-shaped elements in the material storage tank to the material-retrieving height.

[0062] The first support seat 10 and the second support seat 21 are respectively located on both sides of the storage tank in the first direction. The positioning component 3 is configured on ...

Embodiment 2

[0085] An embodiment of the present invention provides a method for feeding plate-shaped components, which is suitable for the feeding device described in Embodiment 1. The feeding method of the feeding device described in Embodiment 1 includes steps S1 to S5:

[0086] S1. The jacking assembly 1 rises to drive the plate-shaped element to rise to a position where the uppermost plate-shaped element can be sensed by the first detection member 15 .

[0087] S2. The first driving member 11 drives the first positioning member 12 close to the second positioning member 16, so that the two sides of the plate-shaped element in the first direction respectively abut the first positioning member 12 and the second positioning member 16, thereby performing position.

[0088] S3. The second driving member 18 drives the two clamping members 14 to approach each other, so as to clamp and fix the uppermost plate-shaped element from the second direction.

[0089] S4. The jacking assembly 1 desce...

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PUM

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Abstract

The invention provides a feeding device for plate-shaped elements, and relates to the technical field of automatic feeding. The feeding device comprises a storage assembly, a jacking assembly, a first supporting seat, a second supporting seat, a positioning assembly and a clamping assembly. A workpiece is jacked to a preset height through the jacking mechanism, then the positioning assembly positions the element in the first direction, and then the clamping assembly positions and clamps the element in the second direction. Therefore, the element is ensured to be in the same position during feeding each time, and errors are greatly reduced. Moreover, after the clamping assembly positions and clamps the element, the jacking assembly descends, so that the uppermost element is suspended so as to be conveniently clamped by a mechanical finger or adsorbed by a suction cup, and good practical significance is achieved.

Description

technical field [0001] The invention relates to the field of automatic feeding, in particular to a feeding device for plate-shaped components. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. [0003] At present, most of the ceramic substrates are loaded into the solder paste machine by manual operation, and they are transported one by one to the conveyor be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/74B65G47/90
CPCB65G47/74B65G47/90Y02P70/50
Inventor 李伟王龙曾凤燕
Owner XIAMEN AEROSPACE SIERT ROBOT SYST CO LTD