Wafer test probe station with high performance and high efficiency

Abstract

The invention discloses a high-performance and high-efficiency wafer test probe station which comprises a first mounting table, a transverse and longitudinal adjusting table is arranged on the first mounting table, a working table is arranged on the transverse and longitudinal adjusting table, a rear support is arranged on the rear side of the working table, an observation lens cone is arranged on the rear support, and a probe is arranged on the observation lens cone. Side face lower mounting pipes are arranged on the portions, located on the two sides of the workbench, of the first mounting table, internal movable rods are arranged in the side face lower mounting pipes, side face upper mounting columns are arranged at the upper ends of the internal movable rods, and a lower mounting plate is arranged between the side face lower mounting pipes. The invention relates to a wafer test probe station with high performance and high efficiency, which belongs to the field of wafer processing, and is characterized in that structures such as a first screw rod and a second screw rod are arranged, so that vertical height adjustment and horizontal position adjustment of a side surface mounting table are facilitated, and structures such as a folded support rod are arranged, so that a wafer can be supported, and the wafer can be conveniently taken out by a user.

Description

Technical field [0001] The present invention relates to the field of probe stations, and more particularly to a wafer test probe station having high performance high efficiency. Background technique [0002] The wafer refers to the silicon wafer used in the production of silicon semiconductor circuits. The original material is silicon, high purity polysilicon dissolved after dissolving silicon crystal seed crystal, then slowly pulled out, forming a cylindrical single crystal silicon, silicon waist After grinding, polishing, slice, the silicon wafer is formed, that is, the wafer, the domestic wafer production line is mainly 8 inches and 12 inches, the main processing method of the wafer is a sheet processing and approval, which is simultaneously processed. Or multiple wafers, as the semiconductor characteristics are getting smaller, machining and measurement equipment are increasing, so that the wafer processing has new data characteristics, during the process of wafer processing,...

AI Technical Summary

Problems solved by technology

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing, and slicing, silicon wafers are formed, that is, wafers. The domestic wafer production lines are mainly 8 inches and 12 inches. The main processing methods of wafers are sheet processing and batch processing, that is, processing 1 piece at the same time. or multiple wafers, as the semiconductor feature size becomes smaller and smaller, processing and measurement equipment become more and more advanced, resulting in new data characteristics in wafer processing. In the process of wafer processing, high-performance and high-performance High-efficiency wafer test probe station, through which the wafer is tested, but in the process of using the traditional test probe station, because the structure of the side mounting platform on both sides is fixed, it cannot be adjusted, and it is inconvenient to use. Place the wafer slice on the middle workbench for inspection. Since the wafer is sheet-shaped, it is easy to fit with the middle workbench. It is troublesome to take out the wafer. If the wafer is pushed sideways, it is easy to cause the wafer Friction and scratches on the circle and table

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