Display panel and manufacturing method thereof

Abstract

The embodiment of the invention discloses a display panel and a manufacturing method thereof. The display panel comprises a substrate; a thin film transistor layer formed on the substrate; a planarization layer formed on the thin film transistor layer; the display panel comprises a planarization layer, and is characterized in that the display panel further comprises a light-emitting element and a pinning structure which are formed on the planarization layer, the light-emitting element and the pinning structure are located in a pixel area and a pinning area of the display panel respectively, and the pinning structure comprises a groove; and the packaging layer covers the light-emitting element and the pinning structure, and at least partial area of the packaging layer is embedded in the groove.

Description

technical field [0001] The invention relates to the field of display technology. More specifically, it relates to a display panel and a manufacturing method thereof. Background technique [0002] With the development of display technology, flexible display devices have appeared in the market for folding screens. Compared with traditional display devices, folding screens have significant advantages. Peeling, shedding problem. An important reason for the current failure is that the adhesion between the layers of the organic light-emitting material using the evaporation process is weak. During the repeated bending process, the long-term shear stress will cause the peeling between the layers to cause the device to fail. [0003] The Chinese patent application with the application number CN202010937199.6 discloses a display panel and its manufacturing method. An undercut structure is added to the backplane to form a pinning structure between the inorganic layer and the substrat...

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Problems solved by technology

[0002] With the development of display technology, flexible display devices have appeared in the market for folding screens. Compared with traditional display devices, folding screens have significant advantages. Peeling, shedding problem

An important reason for the current failure is that the adhesion between the layers of the organic light-emitting material using the evaporation process is weak. During the repeated bending process, the long-term shear stress will cause the peeling between the layers to cause the device to fail.

[0003] The Chinese patent application with the application number CN202010937199.6 discloses a display panel and its manufacturing method. An undercut structure is added to the backplane to form a pinning structure between the inorganic layer and the substrate, but the pinning structure is set on the thin film transistor. In the SD layer, it is necessary to borrow the SD layer, which causes a spatial squeeze on the TFT structure on the backplane, affects the TFT arrangement, and hollows out the flat area too much, which seriously affects the subsequent inkjet printing encapsulation layer. Leveling

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