Light-emitting device and preparation method thereof
A technology for light-emitting devices and light-emitting chips, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of large size, occupying large space, and unfavorable development of miniaturization of LED devices, and achieve compact size and reasonable circuit conduction. The effect of ensuring the stability of the circuit connection
Active Publication Date: 2022-05-13
JIANGXI HONGLI TRONIC CO LTD
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Problems solved by technology
Although this method improves the light efficiency of the LED device to a certain extent, it requires the LED device to have a larger size, resulting in a larger space, which is not conducive to the miniaturization of the LED device.
Method used
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[0037] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing the embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0038] It should be noted that when an element is referred to as being “fixed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only. ...
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Abstract
A light-emitting device and a preparation method thereof, the light-emitting device includes a lead frame and a light-emitting chip, the lead frame includes an upper conductive base material, a thermally conductive isolation layer and a lower conductive base material stacked in sequence, the upper conductive base material includes a conductive outer frame, The first conductive block located in the conductive outer frame, and a plurality of second conductive blocks connected to the inner side of the conductive outer frame, the light-emitting chip is fixed on the first conductive block, the conductive outer frame, the first conductive block and the second conductive block The accommodating groove is formed by surrounding with the heat-conducting isolation layer, and the accommodating groove is filled with a reflective adhesive layer. The lower conductive substrate includes a first electrode and a second electrode with opposite electrode properties, and one of the second conductive blocks is electrically connected through the first lead wire. The other second conductive blocks are bonded and connected to the light-emitting chip, and the first conductive blocks are connected to the second electrodes through the second leads. The light-emitting device satisfies the design requirements for miniaturization of the light-emitting device, and a light-emitting device with high light extraction rate can be obtained through the arrangement of the accommodating groove.
Description
technical field [0001] The invention relates to the technical field of LEDs, in particular to a light emitting device and a preparation method thereof. Background technique [0002] Because of its small size and practicality, LED devices are not only environmentally friendly and energy-saving, but also can greatly meet the advantages of lighting effects and needs, and have been rapidly developed. LED devices are widely used in signal indication applications, display applications, and plant lighting applications. [0003] However, with the increase in market demand, more and more products are in urgent need of higher brightness and higher heat resistance. At the same time, with the intensification of market competition and the reduction of the cost of LED devices and other factors, the market demand for high-efficiency LED devices is becoming more and more obvious. [0004] In the existing LED devices, the light-emitting chip is usually arranged at the bottom of the reflecti...
Claims
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IPC IPC(8): H01L33/62H01L33/60H01L33/54
CPCH01L33/62H01L33/60H01L33/54H01L2933/005H01L2933/0058H01L2933/0066
Inventor 饶德望
Owner JIANGXI HONGLI TRONIC CO LTD