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Liquid ejecting head and liquid ejecting apparatus

A liquid ejection head, liquid technology, applied in the direction of inking device, printing, etc., can solve problems such as electrical failure

Pending Publication Date: 2022-03-04
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the liquid ejection head described in the above document, since the connection terminal portion of the flexible substrate connected to the circuit board is exposed in the liquid ejection head, moisture in the atmosphere that has entered the liquid ejection head adheres to the connection terminal portion and Possibility of electrical failure

Method used

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  • Liquid ejecting head and liquid ejecting apparatus
  • Liquid ejecting head and liquid ejecting apparatus
  • Liquid ejecting head and liquid ejecting apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0030] figure 1 It is an explanatory diagram showing a schematic configuration of the liquid ejecting device 10 in the first embodiment. exist figure 1 In , arrow marks representing mutually orthogonal X, Y, and Z directions are shown. The X direction and the Y direction are directions parallel to the horizontal plane, and the Z direction is the gravity direction. The arrow marks indicating the X, Y, and Z directions are also used in other drawings, and the direction of the arrow marks is the same as figure 1 Appropriately illustrated in a corresponding manner. In the following description, when specifying the orientation, the direction indicated by the arrow mark, that is, the positive direction is set to "+", and the direction opposite to the direction indicated by the arrow mark, that is, the negative direction is set to "-", and Use both plus and minus signs in direction markings. In addition, the +Z direction may be referred to as a "first direction D1", the +X direc...

Embodiment approach

[0108] (B1) Figure 20 is an explanatory diagram showing a contact region in another embodiment. In the liquid ejecting device 10 of the above-described embodiment, one cap 53 is provided for one liquid ejecting head 100 , and one contact region Rc is provided on one fixing plate 150 . On the other hand, a plurality of caps 53 may be provided for one liquid jet head 100 and a plurality of abutting regions may be provided on one fixing plate 150 . For example, if Figure 20 As shown, the fixing plate 150 may have a contact region Rc1 provided so as to surround the three openings 155 arranged on the −X direction side among the six openings 155 , and a contact region Rc1 provided to surround the six openings 155 . The abutment region Rc2 provided in such a manner that three openings 155 are arranged on the +X direction side. Each of the contact regions Rc1 and Rc2 may be provided so as to surround at least one projected image of a plurality of projected images obtained by vert...

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PUM

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Abstract

The invention provides a liquid ejecting head and a liquid ejecting apparatus. In a liquid ejecting head, moisture can be prevented from adhering to a connection terminal portion. The liquid ejecting head includes: a plurality of head chips that eject liquid in a first direction; a holder on which a plurality of head chips are fixed; a circuit board disposed in a direction opposite to the first direction with respect to the holder; and a cover member disposed in a direction opposite to the first direction with respect to the circuit board. The plurality of head chips have a flexible wiring substrate, the flexible wiring substrate has a connection terminal portion connected to the circuit board, the cover member has a plurality of first ribs protruding toward the circuit board, the first ribs are disposed at positions overlapping the connection terminal portion when viewed in the first direction, and the second ribs are disposed at positions overlapping the connection terminal portion when viewed in the second direction. A first adhesive is disposed between the first rib and the connection terminal portion.

Description

technical field [0001] The present disclosure relates to a liquid ejection head and a liquid ejection device. Background technique [0002] Patent Document 1 discloses a liquid ejection head comprising: a lower case member that accommodates a plurality of head chips; a circuit board laminated on the lower case member; and an upper case member. , which is laminated on the lower case member in such a manner as to cover the circuit substrate. In this liquid ejection head, the piezoelectric actuator elements provided on the respective head chips and the circuit board are connected via a flexible substrate. [0003] In the liquid ejection head described in the above document, since the connection terminal portion of the flexible substrate connected to the circuit board is exposed in the liquid ejection head, moisture in the atmosphere that has entered the liquid ejection head adheres to the connection terminal portion and Possibility of electrical failure. [0004] Patent Docu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/14
CPCB41J2/14B41J2/14201B41J2/14233B41J2002/14362B41J2002/14491B41J2002/14419B41J2202/20B41J2/17523B41J2/17556B41J2/17596B41J2/17509B41J2/175
Inventor 泷野文哉
Owner SEIKO EPSON CORP