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Cover tape and electronic component packaging body

A cover tape and antistatic technology, applied in packaging, conductive coatings, coatings, etc., can solve the problems of insufficient antistatic performance of cover tape and the risk of sticking materials, and achieve excellent antistatic performance and low surface resistivity.

Active Publication Date: 2022-03-11
ZHEJIANG JIEMEI ELECTRONICS & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above solution replaces materials with excellent conductive properties such as metal or carbon in exchange for high transparency, which will lead to insufficient antistatic performance of the cover tape, which will exist in the process of taking microelectronic components with specifications such as 0201, 01005 and 0008004. Sticky risk

Method used

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  • Cover tape and electronic component packaging body
  • Cover tape and electronic component packaging body
  • Cover tape and electronic component packaging body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] In this embodiment, the base material layer a can be selected from commonly used materials in the art, so details will not be repeated here.

[0041] The middle layer b includes two structural layers b1 and b2, and the selected materials are as follows: LDPE (2426: density 0.925g / cm 3 , MI: 1.9), LLDPE (7042: density 0.918g / cm 3 , MI: 1.8), m-LLDPE (5230G: density 0.916g / cm 3 , MI: 4.0), polyether block polyamide (IRGASTA P), sorbitol benzylidene derivatives (DBS). The composition is as follows:

[0042]

[0043] as attached figure 1 As shown, in this embodiment, an antistatic coating c is coated on the surface of the b2 structural layer, and a second antistatic coating e is coated on the opposite surface of the substrate layer a and the intermediate layer b, specifically: 10wt% thiophenes Conductive polymer (polyethylenedioxythiophene / sodium polystyrene sulfonate composite conductive liquid CAS: 155090-83-8), 90wt% isopropanol / water (50 / 50) solution.

[0044] T...

Embodiment 2

[0048] The difference between this embodiment and Embodiment 1 is that the composition of the middle layer b is as follows:

[0049]

Embodiment 3

[0051] The difference between this embodiment and Embodiment 1 is that the composition of the middle layer b is as follows:

[0052]

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PUM

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Abstract

The cover tape sequentially comprises a base material layer, a middle layer, an antistatic coating and a heat sealing layer, the middle layer comprises an ethylene polymer, an antistatic agent and organic particles, and the density of the ethylene polymer is 0.90-0.94 g / cm < 3 >. According to the invention, the middle layer with excellent antistatic property and transparency is arranged, and the antistatic coating and the antistatic heat sealing layer are additionally arranged, so that the cover tape meets the requirements of high transparency and excellent antistatic effect, also has the advantages of good buffering property, good stripping stability and the like, and is particularly suitable for being used as a cover tape for packaging miniature electronic components.

Description

technical field [0001] The invention relates to a cover tape, which is used for a cover body of an electronic component packaging body, and is especially suitable as a cover tape for packaging micro electronic components. Background technique [0002] The packaging body of electronic components is used for the storage, transportation and automatic placement process of electronic components, which consists of a carrier tape and a cover tape. The carrier tape is equidistantly formed on the long strip-shaped sheet to form storage holes matching the size and shape of the electronic components, and accommodate the electronic components; the cover tape is a transparent strip-shaped film, used as an electronic component After the device falls into the storage hole of the carrier tape, the cover tape is used for heat sealing and covering, and wound into a roll to form an electronic component packaging body. [0003] With the development of miniaturization and high performance of el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D73/02C08L23/08C08L77/00C08L23/06C09D5/24C09D165/00C09D125/18C09D175/04
CPCB65D73/02C08L23/0815C08L23/06C09D5/24C09D165/00C09D125/18C09D175/04C08L2207/066C08L77/00C08L25/18C08K3/22
Inventor 王鹏王龙何教滢汤开云陆艳
Owner ZHEJIANG JIEMEI ELECTRONICS & TECH
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