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Laminated composite electronic device and its producing method

An electronic device, lamination technology, applied in the manufacture of inductors/transformers/magnets, inductors, coils, etc., can solve the problem of impossible to obtain ceramics

Inactive Publication Date: 2004-03-10
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, even if different kinds of ceramics are combined, it is impossible to obtain ceramics having a desired coefficient of thermal expansion, and thus it is not enough to completely prevent deformation of the laminated body during cooling after firing

Method used

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  • Laminated composite electronic device and its producing method
  • Laminated composite electronic device and its producing method
  • Laminated composite electronic device and its producing method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0041] Press Fe 2 o 3 49mol%, NiO 42mol%, ZnO 42mol% and CuO 5mol% ratio of raw material powder prepared as ferrite magnetic powder, they were pre-fired at 680 ℃, and then dispersed in an organic binder to Preparation of magnetic slurry. The magnetic slurry was formed into a 30 µ thick magnetic ceramic green sheet by the doctor blade method. It will be mentioned below that the linear expansion coefficient of the magnetic ceramics formed after the magnetic ceramic green sheet is fired is 13.0×10 -6 / °C.

[0042] After a through hole is punched at a predetermined position of a part of the above-mentioned ceramic green sheet, a plurality of ring-shaped inner electrodes of silver paste aligned vertically and / or horizontally are printed, and the silver paste is drawn through the above-mentioned through hole to be printed on the through hole. inner surface to act as a conductor inside the via.

[0043] Prepare mainly containing FiO with above-mentioned same method 2 Dielectri...

example 2

[0058] In the above-mentioned embodiment 1, the ceramic blanks for forming the intermediate ceramic layers a, b, c and d were prepared by adding glass powder to the dielectric ceramics. The substitution methods in this embodiment are as shown in Table 3 The given quantity is added to the magnetic ceramic material with a linear expansion coefficient of 5×10 -6 / ℃ Si-B family glass powder (alumionborosili eat glass aluminoborosilicate glass) to prepare four kinds of magnetic - glass ceramic blanks A, B, C and D. Table 3 also lists the linear expansion coefficients of the intermediate glass-ceramic layers a, b, c and d prepared as above. In addition, for the sake of comparison, Table 3 also lists the linear expansion coefficients of magnetic ceramics and dielectric ceramics.

[0059] Further, in a similar manner to the above-mentioned Example 1, six kinds of laminated bodies 11, which are listed in Table 4, were prepared, using part of the above-mentioned magnetic-glass-ceramic...

example 3

[0064] In the above-mentioned Example 1, the ceramic green sheets for forming the intermediate ceramic layers a, b, c, and d were prepared by adding glass powder to the dielectric ceramic material. In this example, instead of the above-mentioned method, by changing the 2 o 3 , NiO, ZnO and CuO ferrite magnetic ceramics composition, mainly the content of ZnO and CuO, prepared for the formation of various magnetic ceramic green sheets listed in Table 5 from A to P intermediate ceramic layer. Table 5 also lists the linear expansion coefficients of various intermediate glass-ceramic layers formed by firing the above-mentioned magnetic ceramic green sheets A to P as mentioned below.

[0065] From the magnetic ceramics from A to P listed in Table 5 above, it can be seen that in the 2 o 3 , NiO, ZnO and CuO magnetic ceramics, the higher the content of NiO instead of CuO, the higher the coefficient of linear expansion. On the other hand, magnetic ceramics from I to N were found tha...

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Abstract

A laminated composite electronic device has a laminated body formed by stacking ceramic layers which differ from each other in thermal expansion rate. Between those different ceramic layers are inserted intermediate ceramic layers a, b, c and d, each having thermal expansion rates differing from one another so as to reduce the difference between the neighboring ceramic layers in the thermal expansion rate thereof.

Description

technical field [0001] The present invention relates to a laminated composite electronic device with different types of ceramic layers, such as magnetic ceramic layers and dielectric ceramic layers, and its manufacturing method, in particular to a laminated composite electronic device combining an inductance part and a capacitor part In the electronic device, in the inductance part, a spiral internal electrode is formed in the laminated magnetic ceramic layer, and in the capacitor part, a pair of opposing internal electrodes are formed in the laminated dielectric ceramic layer. Background technique [0002] In the manufacture of laminated composite electronic devices, there are two methods for obtaining a laminated body, one is the so-called slurry build method and the other is the so-called sheet build method. method). In the former, that is, the paste configuration method, a method such as screen printing is used to print magnetic paste and conductive paste layer by layer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F41/04
CPCY10T428/24942H01F41/046H01F2017/0026H01F17/0013
Inventor 山口隆志
Owner TAIYO YUDEN KK
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