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Punch forming die

A stamping and molding technology, applied in household appliances, other household appliances, flat products, etc., can solve the problems of uneven distribution, high stress of PC film, etc., and achieve the effect of short production cycle, good fluidity and lower production cost.

Active Publication Date: 2022-03-15
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a stamping die, which aims to solve the problem of large PC film stress and uneven distribution caused by cold stamping

Method used

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0039] At the same time,...

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Abstract

The invention relates to the technical field of stamping devices, and particularly discloses a stamping forming die which comprises an upper die base, a lower die base and a material ejecting device, the upper die base is provided with a punch, the lower die base is provided with a machining groove, a material ejecting cavity with an opening is formed in the groove bottom wall of the machining groove, and a workpiece to be machined covers the opening of the groove bottom wall of the machining groove. The material jacking device comprises a material jacking block and a driving assembly, the material jacking block is arranged in the material jacking cavity, and the driving assembly is connected to the material jacking block so as to drive the material jacking block to slide relative to the material jacking cavity. The punch and the ejector block abut against the two sides of a to-be-machined workpiece, the upper die base drives the punch to stretch and punch the to-be-machined workpiece, the punch presses the workpiece into the ejector cavity from the opening, meanwhile, the driving assembly drives the ejector block to slide along the ejector cavity, the ejector block and the punch move in the same direction, and therefore the pressure borne by the to-be-machined workpiece is not changed. According to the technical scheme, the punch forming die is simple in structure, the production cost is reduced, the production period is short, and the production efficiency is effectively improved.

Description

technical field [0001] The invention relates to the technical field of stamping devices, in particular to a stamping mold. Background technique [0002] Polycarbonate (Polycarbonate, PC) is colorless and transparent, heat-resistant, impact-resistant, has the characteristics of high mechanical strength, wide operating temperature range, and good electrical insulation performance, and can be used to protect chips. [0003] When PC film is hot-stamped, it is first necessary to heat and form the PC film, and then cool down the formed product. The process is complicated, more equipment is invested, and the production cycle is longer, resulting in low production efficiency and high production costs. When the PC film is cold-stamped, the stress distribution of the PC film will be uneven, and the stress will be large, resulting in distortion of the processed product, and the stability of the product size cannot be guaranteed. [0004] Therefore, the problem of high stress and uneve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/02B29C43/36B29C43/50B29L7/00
CPCB29C43/02B29C43/50B29C43/3642B29C2043/503B29L2007/00
Inventor 杨卫海
Owner GEER TECH CO LTD