A low power consumption and high precision protocol integrated circuit module packaging process

Abstract

The invention discloses a low-power consumption and high-precision protocol integrated circuit module packaging process, which can reduce the probability of chip offset, flying wire breakage or parallel connection between flying wires during the packaging process of the circuit module. When bonding, the metal frame is fixedly set on the top of the circuit substrate, and the reinforcing rib is fixedly installed on the top of the metal frame, which can effectively reduce the probability of chips and flying leads being affected by the flow of epoxy resin during injection molding packaging, which is conducive to improving Production stability. At the same time, by installing the metal frame on the top of the circuit substrate, the probability of product fracture during later cutting can be reduced, which is conducive to improving the structural strength of the small circuit module produced by this process. To a certain extent Improved product quality.

Description

technical field [0001] The invention relates to the field of circuit module packaging, and more specifically relates to a low-power consumption and high-precision protocol integrated circuit module packaging process. Background technique [0002] Nowadays, the main trend of products in the global fast charging protocol market is high efficiency and high reliability. Among them, the charging protocol fast charging 3.0 is based on a chip (2) mV increment, which can provide mobile phones with flexible voltage from 3.6V to 12V. Selection, so that the mobile phone can obtain just the right voltage, so as to achieve the expected charging current, can achieve the effect of minimizing power loss, improving charging efficiency and improving thermal performance, and is widely loaded in today's circuit modules. [0003] When the circuit module is produced, in order to ensure its stability in the later installation and use process, it needs to be packaged. The circuit module packaging p...

AI Technical Summary

Problems solved by technology

[0003] When the circuit module is produced, in order to ensure its stability in the later installation and use process, it needs to be packaged. The circuit module packaging process in the prior art is mostly directly on the top of the circuit substrate after the chip is installed. Carry out the plastic encapsulation operation, and directly encapsulate the chips and other units in the epoxy resin. Although this method can effectively implement the encapsulation operation on the circuit substrate, in the actual encapsulation process, it is affected by the flow of the epoxy resin injection process, resulting in the circuit The chips on the substrate and the flying leads of the chips are easily impacted by the flow, causing the chips to shift, the flying leads to break, and the wires to be merged, thereby expanding the defect rate of the product packaging production to a certain extent.

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