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Low-power-consumption high-precision protocol integrated circuit module packaging process

An integrated circuit and packaging process technology, which is applied in the field of low power consumption and high precision protocol integrated circuit module packaging process, can solve the problems of expanding the production defect rate of product packaging, the flying lead is susceptible to flow shock, and the flying lead is broken, etc. The probability of product fracture under force, the effect of improving production stability and ensuring stability

Active Publication Date: 2022-03-15
江苏高格芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the circuit module is produced, in order to ensure its stability in the later installation and use process, it needs to be packaged. The circuit module packaging process in the prior art is mostly directly on the top of the circuit substrate after the chip is installed. Carry out the plastic encapsulation operation, and directly encapsulate the chips and other units in the epoxy resin. Although this method can effectively implement the encapsulation operation on the circuit substrate, in the actual encapsulation process, it is affected by the flow of the epoxy resin injection process, resulting in the circuit The chips on the substrate and the flying leads of the chips are easily impacted by the flow, causing the chips to shift, the flying leads to break, and the wires to be merged, thereby expanding the defect rate of the product packaging production to a certain extent.

Method used

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  • Low-power-consumption high-precision protocol integrated circuit module packaging process
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  • Low-power-consumption high-precision protocol integrated circuit module packaging process

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Embodiment 1

[0057] see Figure 1-Figure 10 , a low-power-consumption high-precision protocol integrated circuit module packaging process, comprising the following steps:

[0058] S1. Chip loading: The interior of the main board 1 is evenly divided into a plurality of circuit substrates 101, and each circuit substrate 101 is provided with a mounting position 102 in the middle of the top, and a plurality of inlaid circuit boards are arranged around the mounting position 102. The first contact 103 on the top of the substrate 101, and the second contact 104 corresponding to the plurality of first contacts 103 are evenly inlaid on the bottom of the circuit substrate 101, and the chip 2 is sequentially placed on the installation position set on the top of the circuit substrate 101 by the grasping robot arm 102 on;

[0059] S2. Bonding: use the welding manipulator to connect the connection point on the chip 2 and the contact point 103 with flying wires. After the flying wire operation is comple...

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Abstract

The invention discloses a low-power-consumption and high-precision protocol integrated circuit module packaging process, which can reduce the probability of chip offset, fly wire breakage or parallel connection among fly wires in the packaging process of a circuit module, and is characterized in that a metal frame is fixedly arranged above a circuit substrate in a sleeving manner when the circuit module is bonded; the metal frame is arranged on the top of the circuit substrate, the reinforcing ribs are fixedly arranged on the top of the metal frame, the probability that chips and fly wires are affected by flowing of epoxy resin during injection molding packaging can be effectively reduced, the production stability can be improved, meanwhile, the metal frame is arranged on the top of the circuit substrate, the probability that products are stressed and broken during later cutting can be reduced, and the product quality is improved. The structural strength of the circuit module small blocks produced by the process is improved, and the product quality is improved to a certain extent.

Description

technical field [0001] The invention relates to the field of circuit module packaging, and more specifically relates to a low-power consumption and high-precision protocol integrated circuit module packaging process. Background technique [0002] Nowadays, the main trend of products in the global fast charging protocol market is high efficiency and high reliability. Among them, the charging protocol fast charging 3.0 is based on a chip (2) mV increment, which can provide mobile phones with flexible voltage from 3.6V to 12V. Selection, so that the mobile phone can obtain just the right voltage, so as to achieve the expected charging current, can achieve the effect of minimizing power loss, improving charging efficiency and improving thermal performance, and is widely loaded in today's circuit modules. [0003] When the circuit module is produced, in order to ensure its stability in the later installation and use process, it needs to be packaged. The circuit module packaging p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/56H01L21/68H01L23/373H01L23/367
CPCH01L24/81H01L21/56H01L21/68H01L23/3737H01L23/3736H01L23/367H01L2224/81007
Inventor 魏永红魏霄鸿马吉祥王国霖李星星
Owner 江苏高格芯微电子有限公司
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