Manufacturing method of MEMS (Micro Electro Mechanical System) packaging carrier plate
A manufacturing method and a technology for encapsulating a carrier board, which are applied in the fields of technology for producing decorative surface effects, decorative arts, and microstructure devices, and can solve the problem of "+" Mark nickel thickness exceeding the standard, sub-surface nickel thickness, and SMD packaging CCD positioning can not be identified and other problems, to achieve the effect of wide application range and strong practicability
Pending Publication Date: 2022-03-18
JIANGSU PROVISION ELECTRONICS CO LTD
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Problems solved by technology
[0002] There are optical points and "+" marks on the bottom surface of the MEMS package substrate for optical positioning. At present, the electrical gold leads on the bottom surface of the MEMS package substrate are conducted through the conductive structure on the edge of the substrate, and there is a nickel thickness deviation on the surface. Large (30μm), optical points on the board surface and "+" Mark nickel thickness seriously exceed the standard, which leads to the situation that the CCD positioning cannot be recognized by SMD
Method used
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Embodiment
[0052] Example: such as Figure 1-4 Shown, a kind of manufacture method of MEMS encapsulation carrier board comprises the following steps:
[0053] Step 1: cutting and baking: cut the substrate into a certain size, and put it in an oven to bake. The substrate 10 has a middle layer 13 and a top layer 11 and a bottom layer 12 located on the upper and lower sides of the middle layer. The upper surface of the top layer 11 is the top surface of the substrate, the lower surface of the top layer is attached to the middle layer, the lower surface of the bottom layer 12 is the bottom surface of the substrate, the upper surface of the bottom layer is attached to the middle layer, and the top layer 11 and the bottom layer 12 are copper Foil layer; the purpose of cutting is to facilitate subsequent equipment processing; the baking conditions are: the temperature is 122-148°C, and the baking time is 2-4h; the substrate is baked to eliminate the stress of the substrate and prevent the subst...
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The invention relates to a manufacturing method of an MEMS (Micro Electro Mechanical System) packaging carrier plate, which comprises the following steps of cutting and baking, top layer circuit, laser windowing, laser drilling and hole filling, bottom layer circuit, resistance welding, nickel and gold electroplating and gold electroplating post-treatment, the packaging carrier plate is finally obtained through a series of processes, and the packaging carrier plate adopts a brand new gold electroplating lead conduction process, so that the production cost is reduced, and the production efficiency is improved. According to the method, the laser through hole is formed in the top surface of the product to the bottom surface, the gold plating lead on the bottom surface is conducted through the through hole, and the gold plating lead is provided with the optical point and the + Mark, so that the nickel thickness of the optical point and the + Mark on the bottom surface is effectively controlled, the appearance of the gold plating lead is not deformed, the nickel thickness is controlled within 10 microns, the requirements of customers are met, and CCD recognition and positioning during SMD part punching are facilitated.
Description
technical field [0001] The invention relates to a package carrier board, in particular to a method for manufacturing a MEMS package carrier board. Background technique [0002] There are optical points and "+" marks on the bottom surface of the MEMS package substrate for optical positioning. At present, the electrical gold leads on the bottom surface of the MEMS package substrate are conducted through the conductive structure on the edge of the substrate, and there is a nickel thickness deviation on the surface. Large (30μm), optical point on the board surface and "+" Mark nickel thickness seriously exceed the standard, which leads to the situation that the CCD positioning of SMD cannot be recognized. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a method for manufacturing a MEMS package carrier board. The package carrier board is laser-formed from the top surface to the bottom surface through holes, and...
Claims
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Login to View More IPC IPC(8): H05K3/40H05K3/18B81C1/00
CPCH05K3/4038H05K3/18B81C1/00261
Inventor 马洪伟胡正洋
Owner JIANGSU PROVISION ELECTRONICS CO LTD