Method and system for reducing adhesive strength and associated pull-out stress

A technology of bonding strength and stress, applied in the direction of bonding methods, adhesives, material gluing, etc., can solve problems such as reducing part warping, low modulus, lack of absorbing stress, damage, etc.

Pending Publication Date: 2022-03-18
LORD CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the case of semiconductor applications, adhesives or thermal interface materials prevent access to components, such as silicon chips or microprocessors, because the adhesive's high bond strength can easily

Method used

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  • Method and system for reducing adhesive strength and associated pull-out stress
  • Method and system for reducing adhesive strength and associated pull-out stress
  • Method and system for reducing adhesive strength and associated pull-out stress

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Embodiment Construction

[0083]In a first exemplary embodiment disclosed herein, there is provided a method for forming an adhesive bond between at least two substrates that reduces the amount of pull required to separate the substrates when the substrates are separated from each other. Stress relief (eg, defined as force of removal divided by bonded surface area). The method includes adhesively bonding a plurality of substrates on bonding regions where a first bonding region has a first adhesive different from a second adhesive applied on a second bonding region. The bonding agent, the bonding strength of the second adhesive in the second bonding area is lower than the bonding strength of the first adhesive in the first bonding area. As used herein, bond strength is related (e.g., directly related) to the pull-off force required to separate adhesively bonded substrates, which means that it takes less time to separate substrates bonded with an adhesive of low bond strength. An adhesive with increased...

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Abstract

Disclosed herein are methods and systems for adhesively bonding a first substrate to a second substrate to reduce pull-out stress during separation of the first substrate and the second substrate, including applying a first adhesive to a first bonding region of a bonding area of the first substrate, applying a second adhesive to a second bonding area of the bonding area of the first substrate, the adhesive strength of the second adhesive being lower than the adhesive strength of the first adhesive, pressing the first substrate and the second substrate against each other to form an adhesive bonding layer, and curing the first adhesive and the second adhesive for a predetermined period of time to form a cured adhesive bond layer between the first substrate and the second substrate.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of and priority to U.S. Provisional Patent Application No. 62 / 880,701, filed July 31, 2019, which is hereby incorporated by reference in its entirety. technical field [0003] The subject matter disclosed herein relates to methods and systems for reducing pull-off stress of adhesively bonded substrates. Background technique [0004] Removal of adhesively bonded substrates typically requires the use of solvents, heat, and / or high mechanical force. However, due to design constraints (e.g., inaccessible adhesive layers) and / or safety considerations (e.g., physical deformation and / or damage to battery assemblies and / or battery cells within such battery assemblies), such as in electric vehicles, Some applications, such as battery packs, do not allow this method. In fact, currently utilized techniques for removing adhesives from the surfaces of battery components are known to irreversibl...

Claims

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Application Information

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IPC IPC(8): C08J5/12C09J5/00F16B11/00H01M10/625H01M10/653H01M10/6554H01M10/6557
CPCC08J5/12F16B11/006C09J5/00H01M10/653H01M10/6557H01M10/6554H01M10/625C09J2203/33C09J2301/208C09J2301/502H01M10/613C09J5/04H01M2220/20
Inventor 蒂莫西·福恩斯阿努罗德·特里帕蒂迈克尔·沙恩·汤普森
Owner LORD CORP
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