A high-precision integrated circuit chip packaging device and its packaging process

Abstract

The invention discloses a high-precision integrated circuit chip packaging device and its packaging technology, comprising an upper case, a lower case and a liner, a chip is fixed on the liner, and the opposite sides of the upper case and the lower case are There is a second light guide frame, the inner and outer sides of the second light guide frame are provided with glued grooves, and the second light guide frame of the upper shell is provided with a mating block, and the four mating blocks are equiangularly divided. Arrangement, the top of the mating block extends through the upper case and is fixed with the first light guide frame, and the second light guide frame of the lower case is provided with a mating groove that matches the mating block. The structure of the present invention is simple , high packaging efficiency, strong heat dissipation and shock resistance of the packaging structure, and can be completely disassembled after packaging, easy to maintain and reuse, simple process, effectively reducing manufacturing costs, has market prospects, and is suitable for promotion.

Description

technical field [0001] The invention relates to the field of chip packaging, more specifically, to a high-precision integrated circuit chip packaging device and a packaging process thereof. Background technique [0002] In the existing semiconductor stack packaging technology, usually an adhesive material is directly arranged between the chips to complete the bonding, and then the bonded chip package is packaged with a resin material. However, in the actual packaging process, especially in the packaging process of high-precision integrated circuit chips, due to the low stability of chip bonding, it is easy to cause chip peeling and dislocation during the process of packaging with resin, which will affect the semiconductor stack. The stability of the packaging structure leads to an increase in manufacturing costs. At the same time, the existing packaging devices do not have shock resistance and high heat dissipation, and cannot effectively protect high-precision integrated ci...

AI Technical Summary

Problems solved by technology

However, in the actual packaging process, especially in the packaging process of high-precision integrated circuit chips, due to the low stability of chip bonding, it is easy to cause chip peeling and dislocation during the process of packaging with resin, which will affect the semiconductor stack. The stability of the packaging structure leads to an increase in manufacturing costs. At the same time, the existing packaging devices do not have shock resistance and high heat dissipation, and cannot effectively protect high-precision integrated circuit chips.

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