Lithographic equipment of semiconductor monolithic integrated circuit
A monolithic integrated circuit and lithography equipment technology, which is applied in the direction of micro-lithography exposure equipment, photomechanical equipment, photo-plate making process coating equipment, etc. Surface dirt and other problems, to achieve the effect of simple structure, prevent surface dirt, simple design
Inactive Publication Date: 2022-03-29
芷江积成电子有限公司
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Problems solved by technology
In the existing lithography technology, the distance between the lithography component structure and the single-chip placement table structure cannot be adjusted. After each step of operation, the semiconductor single-chip needs to be removed manually. Touching the single-chip with fingers will cause the surface to be dirty and bring adverse effects
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0027] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that ...
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The invention discloses photoetching equipment of a semiconductor monolithic integrated circuit, which comprises a frame structure and a photoetching structure, the photoetching structure is arranged on the frame structure, the frame structure is simple in design and low in cost, and a monolithic placement table structure is adopted, so that taking and placing of a semiconductor monolithic in an operation process are avoided, surface smudginess caused by touching the monolithic by fingers is prevented, and the safety of the semiconductor monolithic integrated circuit is improved. The lifting structure can adjust the distance between the photoetching assembly structure and the single chip placing table structure, the lower end of the gluing device is sleeved with the dryer to dry the glued single chip, and the heating structure accelerates the gluing and drying efficiency and improves the production efficiency.
Description
technical field [0001] The invention relates to the technical field of lithography equipment for integrated circuits, in particular to a lithography equipment for semiconductor monolithic integrated circuits. Background technique [0002] Lithography machine is also known as: mask alignment exposure machine, exposure system, lithography system, etc. The commonly used lithography machine is mask alignment lithography. The general lithography process has to go through the surface cleaning and drying of silicon wafers, primer coating, spin-coating photoresist, soft baking, alignment exposure, post-baking, development, and hard baking. , Etching and other processes. In the existing lithography technology, the distance between the lithography component structure and the single-chip placement table structure cannot be adjusted. After each step of operation, the semiconductor single-chip needs to be removed manually. Touching the single-chip with fingers will cause the surface to ...
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IPC IPC(8): G03F7/20G03F7/16
CPCG03F7/70716G03F7/168
Inventor 向宇李艳辉唐春华杨海明向卉向国清
Owner 芷江积成电子有限公司