Turn-to-turn insulating layer of plate-type structure coil and preparation method of turn-to-turn insulating layer
A technology of inter-turn insulation and insulating layer, which is used in coil manufacturing, transformer/inductor coil/winding/connection, electromagnet, etc., to improve the uniform thickness of inter-turn insulation, stable and reliable electrical performance, and high bonding strength.
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Embodiment 1
[0044] Utilize the inter-turn insulation layer of a plate structure coil provided by the present invention to prepare a 7-turn copper plate structure coil. The height of the entire part of the copper plate is more than 5 meters, the length of the upper and lower horizontal sections of the part is close to 2 meters, and the width of the straight section is 0.38 meters. . The thickness of the parts from left to right is progressively thicker, the leftmost end is about 11mm, and the rightmost end has a thickness of 50mm. The preparation method specifically includes the following steps:
[0045] Step A: Grinding the surface of the large-sized copper plate to a surface roughness of not less than 3.2;
[0046] Step B: Clean the surface of the copper plate with alcohol to ensure no scratches, no fingerprints and other stains;
[0047] Step C: Hang the cleaned one-turn copper plate into the die tooling;
[0048] Step D: Pave the inter-turn insulating layer on the copper plate. The ...
Embodiment 2
[0056] Utilize the turn-to-turn insulating layer of a plate structure coil provided by the present invention to prepare a 5-turn copper plate structure coil. The height of the entire part of the copper plate is more than 5 meters, the length of the upper and lower horizontal sections of the part is close to 2 meters, and the width of the straight section is 0.38 meters. . The thickness of the parts from left to right is progressively thicker, the leftmost end is about 11mm, and the rightmost end has a thickness of 50mm. The preparation method specifically includes the following steps:
[0057] Step A: Grinding the surface of the large-sized copper plate to a surface roughness of not less than 3.2;
[0058] Step B: Clean the surface of the copper plate with acetone to ensure no scratches, no fingerprints and other stains;
[0059] Step C: Hang the cleaned one-turn copper plate into the die tooling;
[0060] Step D: Pave the inter-turn insulating layer on the copper plate. Th...
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Abstract
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