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Quick-flushing and quick-discharging groove for integrated circulating cooling and cleaning of semiconductor wafer

A cyclic cooling, semiconductor technology, applied in the fields of fast flushing and fast discharging, and semiconductor wafer processing, it can solve the problems of surface residue, damage, uneven cleaning, etc., and achieve the effect of cleaning the wafer thoroughly and avoiding damage.

Active Publication Date: 2022-04-01
ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a fast-flushing and fast-discharging tank for integrated circulation cooling and cleaning of semiconductor wafers in order to solve the above problems, so as to solve the wafer cleaning method in the prior art, which usually involves chaotic batches of wafers being loaded into flower baskets Cleaning, during the cleaning process, the contact position of the flower basket and the wafer is often not cleaned, which is prone to problems of uneven cleaning and surface residue after cleaning. This cleaning method is also likely to cause damage to the crystal when shaking, resulting in cost the increased problem of

Method used

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  • Quick-flushing and quick-discharging groove for integrated circulating cooling and cleaning of semiconductor wafer
  • Quick-flushing and quick-discharging groove for integrated circulating cooling and cleaning of semiconductor wafer
  • Quick-flushing and quick-discharging groove for integrated circulating cooling and cleaning of semiconductor wafer

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Embodiment Construction

[0039] The embodiment of the present invention provides a quick-flushing and quick-discharging tank for integrated circulation cooling and cleaning of semiconductor wafers.

[0040] see figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 15 , including a cleaning tank 1, the outer side of the cleaning tank 1 is rotatably connected with a cover plate 2, both sides of the inner wall of the cleaning tank 1 are fixedly connected with sliding frames 52, and a fixing plate 3 is arranged between the two sliding frames 52 and is slidably connected with the fixing plate 3 , the top of the fixed plate 3 is provided with a plurality of through grooves 4, the top of the fixed plate 3 is provided with a placement groove 56, and the plurality of placement grooves 56 are distributed around a plurality of through grooves 4 and communicated with the through groove 4, and the top of the fixed plate 3 is provided with A plurality of rin...

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Abstract

The invention provides a fast-flushing and fast-discharging groove for integrated circulating cooling and cleaning of a semiconductor wafer, and relates to the technical field of semiconductor wafer cleaning. The fast-flushing and fast-discharging tank for integrated circulating cooling and cleaning of the semiconductor wafer comprises a cleaning tank, a cover plate is rotatably connected to the outer side of the cleaning tank, sliding frames are fixedly connected to the two sides of the inner wall of the cleaning tank, a fixing plate is arranged between the two sliding frames, and the two sliding frames are slidably connected with the fixing plate; according to the fast-punching and fast-discharging groove for integrated circulating cooling and cleaning of the semiconductor wafers, first racks are arranged in the containing groove, so that second gears push the first racks, clamping plates fixedly connected with one ends of the multiple first racks are used for clamping and fixing the wafers, the multiple wafers can be rapidly fixed, contact with the wafers is reduced, and the wafer cleaning efficiency is improved. And the influence on the cleaning efficiency due to shielding caused by fixation during cleaning is avoided, and meanwhile, the wafer is fixed, so that the wafer is prevented from being damaged due to shaking during cleaning.

Description

technical field [0001] The invention relates to a semiconductor wafer processing technology, in particular to a fast flushing and quick discharge tank used for integrated circulation cooling and cleaning of semiconductor wafers, and belongs to the technical field of semiconductor wafer cleaning. Background technique [0002] Semiconductor materials are the cornerstone of the modern semiconductor industry and microelectronics industry. From a physical point of view, it refers to a class of materials whose conductivity is between conductors and insulators. There are many kinds of semiconductor materials, which can be roughly divided into three types: inorganic semiconductor crystals, organic semiconductor materials and amorphous semiconductors. At present, amorphous semiconductor materials have great application prospects in solar cells. But overall, inorganic semiconductor crystals still dominate semiconductor materials. [0003] Before and after the semiconductor wafer is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687B08B1/00B08B1/04B08B3/02B08B11/02B08B13/00
CPCY02P70/50
Inventor 周训丙陈良
Owner ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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