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High-frequency module

A technology of high-frequency modules and bumps, which is applied to printed circuits connected to non-printed electrical components, coated with non-metallic protective layers, and reduced stress/deformation of printed circuits. It can solve peeling, increased stress of electronic components, The problem of difficult electronic components, etc., to achieve the effect of inhibiting peeling and reducing stress

Pending Publication Date: 2022-04-01
MURATA MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the high-frequency module described in Patent Document 1, since the entire electronic component is in contact with the resin layer, the electronic component is difficult to peel off from the mounting substrate, but there is an increase in the stress applied to the electronic component when the high-frequency module is mounted on the external substrate. The problem

Method used

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  • High-frequency module
  • High-frequency module
  • High-frequency module

Examples

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Embodiment approach

[0016] (1) The structure of the high frequency module

[0017] refer to Figure 1 ~ Figure 3 The structure of the high frequency module 1 of this embodiment is demonstrated.

[0018] The high-frequency module 1 of this embodiment is used for a communication device, for example. The communication device is, for example, a mobile phone such as a smartphone. In addition, the communication device is not limited to a mobile phone, and may be a wearable terminal such as a smart watch, for example.

[0019] The high-frequency module 1 can be electrically connected to an external substrate (not shown). The external substrate corresponds to, for example, a mother substrate of a mobile phone or a communication device. Here, the term that the high frequency module 1 can be electrically connected to the external substrate includes not only the case where the high frequency module 1 is directly mounted on the external substrate, but also the case where the high frequency module 1 is in...

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Abstract

The invention provides a high-frequency module which suppresses peeling of an electronic component from a mounting substrate and reduces stress applied to the electronic component when the high-frequency module is mounted on an external substrate. The mounting substrate (2) has one main surface (first main surface 21). The electronic component (3) has a first surface (31), a second surface (32), and a side surface (33), and is provided on one main surface of the mounting substrate (2). The solder bump (5) is disposed between the mounting substrate (2) and the electronic component (3), and electrically connects the mounting substrate (2) and the electronic component (3). The resin layer (7) is provided on one main surface of the mounting substrate (2) so as to cover the electronic component (3). The first surface (31) is a surface of the electronic component (3) on the opposite side from the mounting substrate (2). A side surface (33) of the electronic component (3) is in contact with the resin layer (7). A space (10) is provided between at least a portion of the first surface (31) and the resin layer (7) in the thickness direction (D1) of the mounting substrate (2).

Description

technical field [0001] The present invention generally relates to a high-frequency module, and more specifically, relates to a high-frequency module including a resin layer covering an electronic component. Background technique [0002] Conventionally, a high-frequency module (receiver module) used in a mobile communication terminal such as a mobile phone is known (for example, refer to Patent Document 1). The high-frequency module described in Patent Document 1 includes a mounting board (wiring board), electronic components (low-noise amplifier, power amplifier), and a resin layer (insulating resin). The mounting substrate has one main surface (first surface). Surface connection mounting between electronic components and one main surface of a mounting substrate is mounting based on flip chip connection. The resin layer is formed to cover the electronic components. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2018-98677 [0004] In the high-frequency module ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/15H01L25/065H01L25/07H01L25/18H04B1/38H05K1/18H05K3/28
CPCH04B1/04H05K3/284H05K1/0271H05K1/181H05K1/0243H01L23/49816H01L23/315H01L2924/181H01L2224/16225H01L2924/15311H01L23/3121H01L23/66H01L2924/00012H01L23/12H01L23/3192H01L25/065H01L2223/6605H01L2223/6644
Inventor 小野麻由香津田基嗣播磨史生姫田高志德矢浩章
Owner MURATA MFG CO LTD