Laser processing method, laser processing equipment and storage medium

A laser processing method and laser technology, applied in laser welding equipment, metal processing equipment, metal processing, etc., can solve problems such as product deformation, inaccurate processing, and inaccurate processing, and achieve high-precision laser processing and improve accuracy.

Inactive Publication Date: 2022-04-12
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this processing method will lead to inaccurate processing
For example, when processing soft boards, the product may be deformed after the pre-processing station is processed, resulting in changes in the position of the feature points on the product. If these feature points are used to point the product for processing, it will lead to inaccurate processing.

Method used

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  • Laser processing method, laser processing equipment and storage medium
  • Laser processing method, laser processing equipment and storage medium
  • Laser processing method, laser processing equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment discloses a laser processing method, which is applied to laser processing equipment, such as a laser cutting machine. figure 1 It is a schematic diagram of a laser processing device in an embodiment of the present invention, such as figure 1 As shown, the laser processing device includes a processing platform 2 , a camera 1 and a vibrating mirror 3 . The processing platform 2 is used to place the product 6, and the processing platform 2 can be an XY platform, that is, a two-dimensional module that can move along the X direction and the Y direction. Camera 1 can be a CCD camera. Both camera 1 and galvanometer 3 are located above the XY platform, and camera 1 is on the left side of galvanometer 3 .

[0050] Based on the above laser processing device, the present invention proposes a laser processing method. The laser processing method can include galvanometer correction and multi-region camera correction. After the correction is completed, the product c...

Embodiment 2

[0087] Embodiment 2 of the present invention is also to provide a laser processing device, which may include but not limited to: one or more processors, and memory.

[0088] As a computer-readable storage medium, the memory can be used to store software programs, computer-executable programs and modules, such as program instructions corresponding to the laser processing method in the embodiment of the present invention. The processor executes various functional applications and data processing of the laser processing equipment by running the software programs, instructions and modules stored in the memory, that is, realizes the above-mentioned laser processing method.

[0089] The memory may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application program required by at least one function; the data storage area may store data created according to the use of the terminal, and the like. In ad...

Embodiment 3

[0091] Embodiment 3 of the present invention also provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, a laser processing method is implemented. The laser processing method includes the following steps:

[0092] S10. Area division: Divide the product to be processed into multiple galvanometer processing areas S 1 , each galvo processing area S 1 Center of MZ n Area S machined for each galvo 1 processing point;

[0093] Divide the product to be processed into multiple camera effective areas S 11 , the effective area S of each camera 11 Center MC n Take pictures of the effective area S for each camera 11 photo spots;

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PUM

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Abstract

The invention discloses a laser processing method, laser processing equipment and a storage medium. The method comprises the steps that a product is divided into a plurality of galvanometer machining areas, and the center of each galvanometer machining area is a machining point of the corresponding galvanometer machining area; dividing the product into a plurality of camera shooting effective areas, wherein the center of each camera shooting effective area is a shooting point of each camera shooting effective area; a product is sequentially moved to all machining points, a plurality of mark points are marked in galvanometer machining areas corresponding to all the machining points through laser, and a coordinate matrix of the mark points of each galvanometer machining area in a galvanometer coordinate system is that the mark points of the galvanometer machining areas corresponding to all the machining points are sequentially moved to corresponding photographing points for photographing; obtaining a coordinate matrix of the mark point in each galvanometer processing area in a camera coordinate system, establishing a conversion matrix between the coordinate matrix and the conversion matrix, and completing camera correction; and after correction is completed, machining areas of the galvanometers are machined in sequence, and large-breadth and high-precision laser machining is achieved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing method, laser processing equipment and a storage medium. Background technique [0002] At present, the cutting of large-format circuit boards mainly uses milling machine cutting and laser cutting. Compared with milling machine cutting, laser cutting improves processing efficiency and section quality, especially for soft boards that cannot be cut by milling machines. [0003] In the commonly used laser processing of large-format circuit boards, a camera is used to locate several feature points on the product to locate the product for processing. However, this processing method will lead to inaccurate processing. For example, when processing soft boards, the product may be deformed after the pre-processing station is processed, resulting in changes in the position of the feature points on the product. If these feature points are used to point the produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/08B23K26/064B23K26/70B23K101/36
Inventor 王昌焱张董洁徐新峰房用桥潘明铮夏炀恒陈鹏高云峰
Owner HANS LASER TECH IND GRP CO LTD
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