Novel laser beam repairing machine workbench

Abstract

The invention discloses a novel laser beam repairing machine workbench which comprises a placing platform, a placing groove is formed in the top of the placing platform, triangular supporting plates are fixedly connected to the four corners of the placing groove, four L-shaped limiting strips are fixedly connected to the bottom of the placing groove, and three supporting ejector pins are arranged at the positions, located among the four L-shaped limiting strips, of the bottom of the placing groove. The device has the beneficial effects that the device is simple and convenient to operate, different models of masks can be limited through the placement groove and the L-shaped limiting strip, and then the masks are finely adjusted through the servo motor arranged at the bottom, so that a displayed image is clearer, and the accuracy is improved.

Description

Technical field: [0001] The invention belongs to the technical field of mask plate making, in particular to a novel laser beam repair machine workbench. Background technique: [0002] The mask is an integrated circuit design pattern composed of a chromium film on a quartz substrate. Its purpose is to transfer the designed integrated circuit pattern to the wafer using mask projection. Repairing is an important process, especially when the integrated circuit process develops to the 7nm technology node, as the feature size of the graphics becomes smaller and the graphics are complex and diverse, the requirements for defects become more and more stringent. Processes such as photolithography process will cause defects to be engraved on the wafer, which will eventually cause abnormal opening and short circuit of the integrated circuit, which will reduce the yield rate of the chip. If it is not repaired, it will be scrapped, which will not only increase the production cost, but als...

AI Technical Summary

Problems solved by technology

[0002] The mask is an integrated circuit design pattern composed of a chromium film on a quartz substrate. Its purpose is to transfer the designed integrated circuit pattern to the wafer using mask projection. Repairing is an important process, especially when the integrated circuit process develops to the 7nm technology node, as the feature size of the graphics becomes smaller and the graphics are complex and diverse, the requirements for defects become more and more stringent. In photolithography and other process processes, defects are re-engraved on the wafer, which eventually leads to abnormal opening and short circuit of the integrated circuit, which reduces the yield rate of the chip. If it is not repaired, it will be scrapped, which will not only increase the production cost, but also affect the product delivery time

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