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Welding method for thickened opaque quartz glass plate

A technology of transparent quartz and welding method, which is applied in the field of semiconductors, can solve problems such as low pass rate, weak welding, high price, etc., and achieve the effect of strong operability and simple and convenient welding process

Active Publication Date: 2022-04-12
SHANGHAI USTRON QUARTZ GLASS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet the requirements of the semiconductor manufacturing process for quartz glass devices, quartz glass processors usually precisely control the size, surface shape and appearance of quartz materials through cold and hot processing. However, the thermal processing method is difficult to control and the pass rate is not high. It is a problem plaguing the industry
Especially the welding of thickened quartz materials is very prone to the problems of poor welding and cracking and scrapping during processing
[0003]Opaque quartz is often used in semiconductor quartz devices for heat preservation and heat insulation. This kind of material is expensive and its mechanical properties are inferior to transparent quartz, so it can only be used in Topical use of semiconductor quartz devices
In the process of processing, there will inevitably be welding problems between opaque quartz and transparent quartz. When the quartz plate is thin, it can be completed by splicing, but when the thickness of the quartz plate exceeds 20mm, or even 30mm, it cannot be completed by splicing. Unable to get a clear opaque, transparent quartz solder interface

Method used

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  • Welding method for thickened opaque quartz glass plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] S1, prepare the transparent quartz, and grind the welding end face of the transparent quartz to obtain a first groove to be welded.

[0043] S2, prepare the opaque quartz, grind the opaque quartz to reach the target thickness of 20mm, and weld the end surface to be a plane, and the plane is a rectangular surface.

[0044] S3, welding transparent quartz welding wire on the welding end face of opaque quartz. According to the diameter of the quartz welding wire, different flame gas flow rates are selected to obtain a firm and bubble-free transparent quartz layer. Process annealing to prevent cracking. By stacking quartz welding wire layer by layer, a trapezoidal transparent quartz part is deposited on the opaque quartz welding end surface as the groove of the semi-finished product, and then machined, and the groove of the semi-finished product is polished into a trapezoidal cross-section. as the second bevel. The second groove height h is equal to 1 / 4 of the thickness H o...

Embodiment 2

[0047] S1, prepare the transparent quartz, and grind the welding end face of the transparent quartz to obtain a first groove to be welded.

[0048] S2, prepare the opaque quartz, grind the opaque quartz to reach the target thickness of 30mm, and weld the end surface to be a plane, and the plane is a rectangular surface.

[0049] S3, welding transparent quartz sheet on the welding end face of opaque quartz, according to the thickness of the quartz sheet, choose different flame gas flow rate, the purpose is to obtain a firm and bubble-free transparent quartz layer, in the middle of the surfacing process, need to carry out Process annealing to prevent cracking. By stacking quartz sheets layer by layer, a trapezoidal transparent quartz part is deposited on the welding end of the opaque quartz as the groove of the semi-finished product, and then mechanically processed, and the groove of the semi-finished product is polished into a trapezoidal cross-section. as the second bevel. Th...

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Abstract

The invention belongs to the technical field of semiconductors, and particularly relates to a welding method for thickened opaque quartz glass plates. A welding method for a thickened opaque quartz glass plate comprises the following steps that S1, the welding end face of first material quartz is ground, and a first groove to be welded is obtained; s2, the second material quartz is ground, the target thickness is achieved, and the welding end face is a plane; s3, a quartz glass piece is fused on the welding end face of the second material quartz, the quartz glass piece is made of the same material as the first material quartz, and another to-be-welded second groove is obtained; and S4, the first groove and the second groove are subjected to filler welding, and a butt welding finished product is obtained. The method is suitable for welding the opaque quartz glass thick plate and the transparent quartz glass, and particularly welding the opaque quartz glass with the thickness of 20 mm or above and even 30 mm or above.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a welding method for thickened opaque quartz glass plates. Background technique [0002] Quartz glass materials and products are widely used in semiconductor chip manufacturing processes, and are carrier devices and cavity consumables required for semiconductor etching, diffusion, oxidation and other processes. In order to meet the requirements of the semiconductor manufacturing process for quartz glass devices, quartz glass processors usually precisely control the size, surface shape and appearance of quartz materials through cold and hot processing. However, the thermal processing method is difficult to control and the pass rate is not high. It is a problem that plagues the industry. Especially the welding of thickened quartz materials is extremely prone to problems such as weak welding and cracking and scrapping during processing. [0003] Opaque quartz fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C27/06B24B1/00
Inventor 胡付俭黄超伟詹峰穆亚南郑汉冰
Owner SHANGHAI USTRON QUARTZ GLASS CO LTD
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