Solvent-free compounding method for packaging film

Abstract

The invention relates to the technical field of packaging film compositing, and discloses a packaging film solvent-free compositing method.The packaging film solvent-free compositing device comprises an output mechanism, the output mechanism comprises a supporting plate, the top end of the supporting plate is fixedly connected with a motor fixing shell, and the interior of the motor fixing shell is fixedly connected with a rotating motor; and an output shaft of the rotating motor is movably connected with a rotating shaft, the side face of the rotating shaft is fixedly connected with a rotating gear, and the side, away from the rotating motor, of the rotating shaft is movably connected with the mounting plate. By arranging the first glue pipe, the second glue pipe, the stirring blades and the stirring shaft, mixing of adhesives is facilitated, gluing work is carried out after the double-component adhesives are fully mixed, a glue layer on the surface of a film base material is more uniform, the final product quality is improved, temperature control is carried out on the single-component adhesives and the double-component adhesives, and the production efficiency is improved. The temperature of the gluing roller is controlled, the temperature of the adhesive is adjusted, the viscosity of the adhesive is changed, and normal gluing work is guaranteed.

Description

technical field [0001] The invention relates to the technical field of packaging film compounding, in particular to a solvent-free compounding method for packaging film. Background technique [0002] Solvent-free lamination uses a 100% solid solvent-free adhesive, a method in which two substrates are bonded together by sizing on a solvent-free lamination machine. There is no solvent residue in solvent-free lamination, and there is no volatile solvent emission during production. Low energy consumption and low production cost. [0003] The adhesive used for solvent-free lamination does not contain solvents, so the final lamination and locking product will not pollute the packaged content due to residual solvents. When printing, the lamination film is printed inside, and the printing surface will not be affected by ink solvents. When compounding, the substrate will not be deformed by the solvent and the heating of the drying tunnel, which is beneficial to improve the flatness ...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a solvent-free compounding method for packaging film. The technical problem to be solved by the present invention is: different production lines are required for the compounding process of the packaging film, and wrinkling is prone to occur after production.

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