Semiconductor equipment precision assembly

Abstract

The invention discloses a semiconductor equipment precision assembly, and belongs to the field of semiconductor equipment, the semiconductor equipment precision assembly can realize automatic heat dissipation of a semiconductor chip, a housing with the lower end connected with a conduit and a heat exchange box is installed on the outer side of the semiconductor chip, and the interior of the housing is filled with a paraffin and magnetic fluid mixture; through cooperation of the magnetic adsorption guide of the permanent magnet plate, a paraffin and magnetic fluid mixture in a fluid state can circularly flow up and down when the semiconductor chip works, heat generated in the semiconductor chip is actively carried outwards, the heat dissipation initiative of the semiconductor chip during working is effectively improved, and meanwhile, when the semiconductor chip stops working, the heat dissipation efficiency of the semiconductor chip is improved. The mixture of the paraffin and the magnetic fluid solidifies and wraps the outer side of the semiconductor chip when no heat is absorbed, so that the semiconductor chip is protected, and the safety protection performance of the semiconductor chip when the semiconductor chip is not used is effectively improved.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, more specifically, to a precision assembly of semiconductor equipment. Background technique [0002] Semiconductor equipment is a kind of circuit equipment made of semiconductor materials. It is produced by circuit chips, which can integrate complex circuits and is widely used in today's production and life. [0003] Semiconductor equipment in the prior art usually directly implants the semiconductor chip on the circuit board. During operation, the operation of the semiconductor chip will generate a large amount of heat. When the device is working, it drives the air flow to perform heat dissipation operation, and its cooling effect is poor, and the semiconductor chip needs to be directly exposed to the outside when it is in contact with the air flow, so that foreign objects are easy to cause damage to the semiconductor chip and affect the service life of the precision components of the semi...

AI Technical Summary

Problems solved by technology

[0003] Semiconductor equipment in the prior art usually directly implants the semiconductor chip on the circuit board. During operation, the operation of the semiconductor chip will generate a large amount of heat. When the device is working, it drives the air flow to perform heat dissipation operation, and its cooling effect is poor, and the semiconductor chip needs to be directly exposed to the outside when it is in contact with the air flow, so that foreign objects are easy to cause damage to the semiconductor chip, which affects the service life of the precision components of semiconductor equipment.

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