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Preparation method of high-thermal-conductivity circuit board, circuit board and application of high-thermal-conductivity circuit board

A circuit board, high thermal conductivity technology, used in circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of serious heat dissipation, easy product damage, affecting the service life of electronic products, etc.

Pending Publication Date: 2022-04-22
江苏煊葳光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the miniaturization of electronic products, the arrangement density of devices is gradually increasing, and the heat dissipation is becoming more and more serious, which affects the service life of electronic products
[0003] At present, the thermal conductivity of aluminum-based circuit boards is poor, and the conductivity of aluminum-based circuit boards is 1-2W / (m 2 K), the effect is not good on products that require high thermal conductivity. For products that require high thermal conductivity, aluminum nitride or alumina substrates are used as heat-conducting circuit boards, and the size of aluminum nitride or alumina substrates cannot be enlarged, and the product is easily damaged. , the flatness of the product is not good, the post-processing is difficult, and there are many problems and the defect rate is high

Method used

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  • Preparation method of high-thermal-conductivity circuit board, circuit board and application of high-thermal-conductivity circuit board
  • Preparation method of high-thermal-conductivity circuit board, circuit board and application of high-thermal-conductivity circuit board
  • Preparation method of high-thermal-conductivity circuit board, circuit board and application of high-thermal-conductivity circuit board

Examples

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Effect test

Embodiment 1

[0030] see figure 1 The structure of an embodiment of the high thermal conductivity circuit board of the present invention is shown, and the application range of this structure includes LED lamps with small volume and high power, and high-power lamps with power above 100W. After the planar substrate 100 is cut to a processing size, the surface area of ​​the planar substrate 100 is sprayed with a nanometer heat-conducting insulating substance to form an insulating layer 200 , and then a circuit layer 300 is printed on it. The high thermal conductivity circuit board of the present invention can use a conductive substrate, such as aluminum alloy, magnesium alloy, zinc alloy, copper, iron and other metals, preferably made of copper; a non-conductive substrate can also be used, such as glass fiber, thermally conductive plastic, or other material; or use a multi-layer composite substrate.

[0031] Please continue to figure 2 , the embodiments of the present invention specifically...

Embodiment 2

[0033] read on image 3 , The difference between the embodiment of the present invention and embodiment 1 is that the insulating layer is made by arc spraying nano heat-conducting insulating material:

[0034] Firstly, the heat-conducting and insulating material is made of nanospheres by dry crushing method, and then the nano-powder is made by mixing the active agent, and additives are added at the same time, and then the heat-conducting insulation is melted by using an arc burning between two continuously fed metal wires A high-speed airflow is used to atomize the molten heat-conducting insulating material, and accelerate the atomized particles of the heat-conducting insulating material so that they are sprayed toward the substrate 100 to form a nanometer insulating layer 200 . Other steps are the same as in Example 1.

[0035] The high thermal conductivity circuit board prepared by the method of the present application has high thermal conductivity, and the circuit board ad...

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Abstract

The invention relates to the technical field of circuit boards, in particular to a preparation method of a high-thermal-conductivity circuit board, the circuit board and application of the circuit board. Comprising the following steps that S1, a base plate is cut, specifically, the base plate is cut into the machining size; s2, insulating the substrate: performing nano spraying of a heat-conducting insulating substance on the surface of the cut substrate to prepare an insulating layer; and S3, printing a conducting medium: printing the conducting medium on the surface of the insulating layer by using a steel mesh printing or silk-screen printing technology, and curing the conducting medium on the substrate after baking curing or UV curing to form a circuit layer. The product provided by the invention has the effect that an aluminum-based circuit board is easy to process and form, can be made into two-dimensional and three-dimensional shapes, is not limited in overall dimension, has the heat conduction effect of greater than 20-250W / (m < 2 >. K), and has a high heat conduction effect.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for preparing a circuit board with high thermal conductivity, the circuit board and its application. Background technique [0002] The circuit board is the provider of the electrical connection of electronic components. The main advantage of using the circuit board is to integrate the collection of various electronic components and functional modules, greatly reduce the errors of manual wiring and assembly, and improve the automation level and production efficiency of electronic product assembly. . The circuit board is based on an insulating board, cut to a certain size, with multiple conductive patterns attached to it, and is equipped with via holes to realize the interconnection between electronic components. Due to the miniaturization of electronic products, the arrangement density of devices is gradually increasing, and the heat dissipation is becoming more a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/12H05K1/03H05K1/05
CPCH05K3/0011H05K3/0044H05K3/0052H05K3/1216H05K1/053H05K1/0306
Inventor 王子欣孙波
Owner 江苏煊葳光电科技有限公司