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Wafer back cutting device

A wafer and back-cutting technology, applied in auxiliary devices, transportation and packaging, welding/cutting auxiliary equipment, etc., can solve problems such as wafer processing that cannot be metal-coated

Pending Publication Date: 2022-04-26
河南通用智能装备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The current implicit cutting is performed from the front side of the wafer, and it is impossible to process wafers with metal coating on the surface

Method used

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  • Wafer back cutting device
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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the present invention. Apparently, the described embodiment is only a part of the implementation of the present invention, rather than the entire implementation. Based on the embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative work belong to The protection scope of the present invention.

[0015] Such as Figure 1-Figure 2 shown. Wafer backcutting device, comprising: two horizontal multi-joint robotic arms arranged on the same lifting column 6, and a wafer feeding platform 1, a three-axis wafer pre-positioning device 2 and The hidden wafer cutting device and the ceramic carrier 4 fixed on the wafer laser implicit cutting platform 3 are characterized in that the horizontal multi-joint mechanical arms are respectively the first horizontal multi-jo...

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Abstract

The invention discloses a wafer back cutting device which comprises two horizontal multi-joint mechanical arms arranged on the same lifting stand column, a wafer feeding platform matched with the horizontal multi-joint mechanical arms, a three-axis wafer pre-positioning device, a wafer hidden cutting device fixed to a wafer laser hidden cutting platform and a ceramic carrying table. The horizontal multi-joint mechanical arms comprise the first horizontal multi-joint mechanical arm and the second horizontal multi-joint mechanical arm, a U-shaped frame is fixed to the movable end of the first horizontal multi-joint mechanical arm, a first rotating motor is fixed to the upper end of the U-shaped frame, and a first suction cup mechanical arm is fixed to the output end of the first rotating motor. A second rotating motor is directly fixed to the movable end of the second horizontal multi-joint mechanical arm, a second suction cup mechanical arm is fixed to the output end of the second rotating motor, and a U-shaped opening of the U-shaped frame provides receding for the second horizontal multi-joint mechanical arm.

Description

technical field [0001] The invention relates to the field of wafer backcutting, in particular to a wafer backcutting device. Background technique [0002] With the advancement of technology, smart wearables, smart phones and tablet computers are developing towards high-speed and large-capacity storage; the volume is developing towards thinning, and the direction of technological development requires that flash memory and memory controllers also continue to be thinner, and the wafer area tends to Larger and thinner, the thickness tends to be thinner, making the chipping problem more challenging in conventional processes when handling and dicing extremely thin wafers. The increase in volume and the decrease in thickness will increase the internal stress during wafer processing. With the lack of self-strength, the warpage of the wafer surface will easily increase. Therefore, cutting the inside of the wafer first, and thinning the wafer can effectively avoid wafer warpage cause...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/70B23K37/047B25J11/00B25J15/06H01L21/67H01L21/677
CPCH01L21/67092H01L21/67742B23K26/38B23K26/402B23K26/702B25J15/06B25J11/00B23K37/047
Inventor 陶为银
Owner 河南通用智能装备有限公司
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